Potentiostatic deposition of thin films of Ni-Fe alloys

IF 1.2 4区材料科学 Q4 ELECTROCHEMISTRY

Transactions of The Institute of Metal Finishing Pub Date : 1999-01-01 DOI:10.1080/00202967.1999.11871254

C. L. Aravinda, S. Mayanna

引用次数: 5

Abstract

SUMMARYThin films of Ni-Fe alloys of various compositions have been deposited potentiostatically from an alkaline sulfate bath solution containing the sodium salt of ethylene diamine tetraacetic acid (EDTA) and triammonium citrate (TAC). The complex nature of the bath solution was analyzed by cyclic potentiometric and spectrophotometric studies. The composition of the alloy was found to vary with the plating bath composition (Ni/Fe), plating potential and the concentration of complexing agent (EDTA). XRD studies showed that alloys are solid solutions of Fe in Ni (γ-Phase) with fcc structure, free from oxides/hydroxides and pore free. The surface analysis by SEM revealed the nucleation by crystallites giving smooth deposit. The magnetic properties (Hc, Ms and squareness ratio) were evaluated from the parallel (in-plane) and perpendicular hysteresis loops. Plating conditions were optimized to plate good quality thin films of Ni-Fe alloy with 80% Ni(Permalloy) with tailor made magnetic properties which suit ...

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Ni-Fe合金薄膜的恒电位沉积

在含有乙二胺四乙酸(EDTA)和柠檬酸三铵(TAC)钠盐的碱性硫酸盐浴液中，恒电位沉积了不同成分的Ni-Fe合金薄膜。用循环电位法和分光光度法分析了浴液的复杂性质。合金的组成随镀液成分(Ni/Fe)、镀液电位和络合剂(EDTA)浓度的变化而变化。XRD研究表明，该合金为Fe在Ni (γ-相)中的固溶体，具有fcc结构，不含氧化物/氢氧化物，无孔洞。表面扫描电镜分析显示，晶核形成，镀层光滑。从平行(面内)和垂直磁滞回线评价了磁滞回线的磁性能(Hc、Ms和方度比)。通过优化电镀条件，可制备出高质量的Ni- fe合金薄膜，该薄膜含有80%的Ni(Permalloy)，具有定制的磁性能。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Transactions of The Institute of Metal Finishing 工程技术-材料科学：膜

CiteScore

3.40

自引率

10.50%

发文量

审稿时长

3 months

期刊介绍： Transactions of the Institute of Metal Finishing provides international peer-reviewed coverage of all aspects of surface finishing and surface engineering, from fundamental research to in-service applications. The coverage is principally concerned with the application of surface engineering and coating technologies to enhance the properties of engineering components and assemblies. These techniques include electroplating and electroless plating and their pre- and post-treatments, thus embracing all cleaning pickling and chemical conversion processes, and also complementary processes such as anodising. Increasingly, other processes are becoming important particularly regarding surface profile, texture, opacity, contact integrity, etc.