Metal distribution in electroplating of nickel and chromium

IF 1.2 4区材料科学 Q4 ELECTROCHEMISTRY

Transactions of The Institute of Metal Finishing Pub Date : 1998-01-01 DOI:10.1080/00202967.1998.11871201

S. Jayakrishnan, K. Dhayanand, R. Krishnan, R. Sekar, S. Sriveeraraghavan

引用次数: 5

Abstract

SummaryElectroplating is a surface treatment method widely adopted for corrosion prevention. For obtaining decorative finishes with corrosion resistance on steel surfaces, it is a normal practice to employ decorative nickel—chromium plating consisting of thick nickel layers followed by flash chromium. For functional applications necessitating hardness and wear resistance, thick chromium plating is carried out either directly on steel or over a nickel undercoat. Heavy coatings of nickel and chromium for industrial applications call for thickness uniformity over complicated shaped basis metal surfaces.In the present investigation, a comparative evaluation of nickel and chromium plating is undertaken. Distributions of metal on plain as well as bent cathodes are determined. For a bent cathode with a specified geometry, the improvement in metal distribution brought about by changing the anode configuration is studied and reported.

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电镀镍、铬时的金属分布

电镀是一种广泛采用的表面防腐处理方法。为了在钢表面获得具有耐腐蚀性的装饰性饰面，通常采用由厚镍层和闪蒸铬组成的装饰性镍铬镀。对于需要硬度和耐磨性的功能性应用，直接在钢上镀厚铬或在镍底涂层上镀厚铬。工业应用的镍和铬厚镀层要求在复杂形状的基金属表面上厚度均匀。在本研究中，对镀镍和镀铬进行了比较评价。测定了金属在平阴极和弯曲阴极上的分布。对具有特定几何形状的弯曲阴极，研究并报道了改变阳极结构所带来的金属分布的改善。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Transactions of The Institute of Metal Finishing 工程技术-材料科学：膜

CiteScore

3.40

自引率

10.50%

发文量

审稿时长

3 months

期刊介绍： Transactions of the Institute of Metal Finishing provides international peer-reviewed coverage of all aspects of surface finishing and surface engineering, from fundamental research to in-service applications. The coverage is principally concerned with the application of surface engineering and coating technologies to enhance the properties of engineering components and assemblies. These techniques include electroplating and electroless plating and their pre- and post-treatments, thus embracing all cleaning pickling and chemical conversion processes, and also complementary processes such as anodising. Increasingly, other processes are becoming important particularly regarding surface profile, texture, opacity, contact integrity, etc.