Superfast fronts of impact ionization in initially unbiased layered semiconductor structures

IF 0.9 4区 计算机科学 Q4 COMPUTER SCIENCE, INFORMATION SYSTEMS
Sigmod Record Pub Date : 2002-07-30 DOI:10.1063/1.1494113
P. Rodin, U. Ebert, W. Hundsdorfer, I. Grekhov
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引用次数: 44

Abstract

textabstractWe present results of numerical simulations of superfast impact ionization fronts in initially unbiased layered semiconductor structures.We demonstrate that when a sufficiently sharp voltage ramp $A > 10^{12} ; { m V/s}$ is applied in the reverse directionto an initially unbiased Si $p^{+}-n-n^{+}$-structure connected in series with a load $R$, then after some delay the system will reach the high conductivity state via the propagation of a superfast impact ionization frontwhich leaves a dense electron-hole plasma behind.The front travels towards the anode with a velocity $v_f$ several times largerthan the saturated drift velocity of electrons $v_s$.The excitation of the superfast front corresponds to the transitionfrom the common avalanche breakdown of a semiconductor structure toa collective mode of streamer-like breakdown.For a structure with typical thickness of$W sim 100 ; { m mu m}$, first there is a delay of about$1 ; { m ns}$ during which the voltage reaches a value ofseveral kilovolts. Then, as the front is triggered, the voltageabruptly breaks down to several hundreds of voltswithin $sim 100 ; { m ps}$. This provides a voltage rampof up to $sim 2 cdot 10^{13}; { m V/s}$, hence up to 10times sharper than the externally applied ramp.We unravel the source of initial carriers which trigger the frontand explain the origin of the time delay in triggering the front.Further we identify the mechanism of front propagation and discussthe possibility to excite superfast ionizationfronts not in layered structures but in bulk semiconductors.
初始无偏置层状半导体结构中撞击电离的超高速前沿
本文给出了在初始无偏层状半导体结构中超高速碰撞电离前沿的数值模拟结果。我们证明,当一个足够尖锐的电压斜坡$ a > 10^{12};{m V/s}$以相反的方向作用于初始无偏Si $p^{+}-n-n^{+}$-结构与负载$R$串联,然后经过一定的延迟,系统将通过超高速撞击电离前沿的传播达到高导电性状态,并留下致密的电子空穴等离子体。锋面向阳极移动的速度是电子饱和漂移速度v_f的几倍。超高速锋面的激发对应于半导体结构从常见的雪崩击穿到流状物击穿的集体模式的转变。对于典型厚度为$ wsim 100的结构;{m mu m}$,首先有大约$1的延迟;{m ns}$在此期间电压达到几千伏的值。然后,当前端被触发时,电压突然下降到几百伏,在100美元以内;{m ps}$。这提供了一个高达$sim 2 cdot 10^{13}的电压斜坡;{m V/s}$,因此比外部施加的斜坡锐利10倍。我们揭示了触发前端的初始载波的来源,并解释了触发前端的时间延迟的来源。进一步,我们确定了前沿传播的机制,并讨论了在层状结构中而不是在块状半导体中激发超高速电离前沿的可能性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Sigmod Record
Sigmod Record 工程技术-计算机:软件工程
CiteScore
3.10
自引率
9.10%
发文量
41
审稿时长
>12 weeks
期刊介绍: SIGMOD investigates the development and application of database technology to support the full range of data management needs. The scope of interests and members is wide with an almost equal mix of people from industryand academia. SIGMOD sponsors an annual conference that is regarded as one of the most important in the field, particularly for practitioners. Areas of Special Interest: Active and temporal data management, data mining and models, database programming languages, databases on the WWW, distributed data management, engineering, federated multi-database and mobile management, query processing & optimization, rapid application development tools, spatial data management, user interfaces.
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