Development of palladium nanoparticles deposition on a copper substrate using a molecular dynamic (MD) simulation: a cold gas dynamic spray process

IF 1.9 Q3 ENGINEERING, MANUFACTURING
S. Oyinbo, T. Jen, S. A. Aasa, O. Abegunde, Yudan Zhu
{"title":"Development of palladium nanoparticles deposition on a copper substrate using a molecular dynamic (MD) simulation: a cold gas dynamic spray process","authors":"S. Oyinbo, T. Jen, S. A. Aasa, O. Abegunde, Yudan Zhu","doi":"10.1051/mfreview/2020028","DOIUrl":null,"url":null,"abstract":"The objective of this study is to create an ultra-thin palladium foil with a molecular dynamic (MD) simulation technique on a copper substrate surface. The layer formed onto the surface consists of a singular 3D palladium (Pd) nanoparticle structure which, by the cold gas dynamic spray (CGDS) technique, is especially incorporated into the low-cost copper substrate. Pd and Cu have been chosen for their possible hydrogen separation technology applications. The nanoparticles were deposited to the substrate surface with an initial velocity ranging from 500 to 1500 m/s. The particle radius was 1 to 4 nm and an angle of impact of 90° at room temperature of 300 K, in order to evaluate changes in the conduct of deformation caused by effects of size. The deformation mechanisms study revealed that the particle and substrate interface is subject to the interfacial jet formation and adiabatic softening resulting in a uniform layering. However, shear instabilities at high impact speeds were confirmed by the evolution of von Mises shear strain, temperature evolution and plastic strain. The results of this study can be used to further our existing knowledge in the complex spraying processes of cold gas dynamic spray technology.","PeriodicalId":51873,"journal":{"name":"Manufacturing Review","volume":null,"pages":null},"PeriodicalIF":1.9000,"publicationDate":"2020-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1051/mfreview/2020028","citationCount":"6","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Manufacturing Review","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1051/mfreview/2020028","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, MANUFACTURING","Score":null,"Total":0}
引用次数: 6

Abstract

The objective of this study is to create an ultra-thin palladium foil with a molecular dynamic (MD) simulation technique on a copper substrate surface. The layer formed onto the surface consists of a singular 3D palladium (Pd) nanoparticle structure which, by the cold gas dynamic spray (CGDS) technique, is especially incorporated into the low-cost copper substrate. Pd and Cu have been chosen for their possible hydrogen separation technology applications. The nanoparticles were deposited to the substrate surface with an initial velocity ranging from 500 to 1500 m/s. The particle radius was 1 to 4 nm and an angle of impact of 90° at room temperature of 300 K, in order to evaluate changes in the conduct of deformation caused by effects of size. The deformation mechanisms study revealed that the particle and substrate interface is subject to the interfacial jet formation and adiabatic softening resulting in a uniform layering. However, shear instabilities at high impact speeds were confirmed by the evolution of von Mises shear strain, temperature evolution and plastic strain. The results of this study can be used to further our existing knowledge in the complex spraying processes of cold gas dynamic spray technology.
用分子动力学(MD)模拟在铜衬底上沉积钯纳米粒子:冷气体动态喷涂过程
本研究的目的是利用分子动力学(MD)模拟技术在铜衬底表面制备超薄钯箔。在表面形成的层由单一的三维钯(Pd)纳米颗粒结构组成,通过冷气体动态喷涂(CGDS)技术,特别将其纳入低成本的铜基板中。选择钯和铜是由于它们可能的氢分离技术应用。纳米颗粒以500 ~ 1500m /s的初始速度沉积到衬底表面。在室温300 K下,颗粒半径为1 ~ 4 nm,冲击角为90°,以评价尺寸对变形行为的影响。变形机理研究表明,颗粒与基体界面受界面射流形成和绝热软化的影响,形成均匀的层状。然而,von Mises剪切应变、温度演化和塑性应变的演化证实了高冲击速度下的剪切不稳定性。本研究的结果可用于进一步深化我们在复杂喷涂过程中的冷气动态喷涂技术的现有知识。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Manufacturing Review
Manufacturing Review ENGINEERING, MANUFACTURING-
CiteScore
5.40
自引率
12.00%
发文量
20
审稿时长
8 weeks
期刊介绍: The aim of the journal is to stimulate and record an international forum for disseminating knowledge on the advances, developments and applications of manufacturing engineering, technology and applied sciences with a focus on critical reviews of developments in manufacturing and emerging trends in this field. The journal intends to establish a specific focus on reviews of developments of key core topics and on the emerging technologies concerning manufacturing engineering, technology and applied sciences, the aim of which is to provide readers with rapid and easy access to definitive and authoritative knowledge and research-backed opinions on future developments. The scope includes, but is not limited to critical reviews and outstanding original research papers on the advances, developments and applications of: Materials for advanced manufacturing (Metals, Polymers, Glass, Ceramics, Composites, Nano-materials, etc.) and recycling, Material processing methods and technology (Machining, Forming/Shaping, Casting, Powder Metallurgy, Laser technology, Joining, etc.), Additive/rapid manufacturing methods and technology, Tooling and surface-engineering technology (fabrication, coating, heat treatment, etc.), Micro-manufacturing methods and technology, Nano-manufacturing methods and technology, Advanced metrology, instrumentation, quality assurance, testing and inspection, Mechatronics for manufacturing automation, Manufacturing machinery and manufacturing systems, Process chain integration and manufacturing platforms, Sustainable manufacturing and Life-cycle analysis, Industry case studies involving applications of the state-of-the-art manufacturing methods, technology and systems. Content will include invited reviews, original research articles, and invited special topic contributions.
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