Fanming Cai, Zhaomiao Liu, Nan Zheng, Yanlin Ren, Yan Pang
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引用次数: 1
Abstract
The boiling heat transfer technology with cavity surfaces can provide higher heat flux under lower wall superheat, which is of great significance for the cooling of electronic chips and microelectromechanical devices. In this paper, the boiling characteristics of the cavity surfaces are investigated based on the lattice Boltzmann (LB) method, focusing on the effects of cavity shapes, sizes, and heater thermal conductivity on the heat transfer performance. The results show that the triangular cavity has the best boiling performance since it has less residual vapor and higher bubble departure frequency than those of the trapezoidal and rectangular cavities. As the cavity size increases, the enhancement of heat transfer by the cavity mouth is suppressed by the heat accumulation effect at the heater bottom. The liquid rewetting process during bubble departure is the reason for the fluctuation of the space-averaged heat flux, and the heater thermal conductivity determines the fluctuation amplitude. The evaporation of liquid in the cavity with high thermal conductivity walls is more intense, resulting in shorter waiting time and higher bubble departure frequency.
期刊介绍:
Applied Mathematics and Mechanics is the English version of a journal on applied mathematics and mechanics published in the People''s Republic of China. Our Editorial Committee, headed by Professor Chien Weizang, Ph.D., President of Shanghai University, consists of scientists in the fields of applied mathematics and mechanics from all over China.
Founded by Professor Chien Weizang in 1980, Applied Mathematics and Mechanics became a bimonthly in 1981 and then a monthly in 1985. It is a comprehensive journal presenting original research papers on mechanics, mathematical methods and modeling in mechanics as well as applied mathematics relevant to neoteric mechanics.