Deformation mechanisms and fracture in tension under cyclic bending plus compression, single point and double-sided incremental sheet forming processes

IF 14 1区 工程技术 Q1 ENGINEERING, MANUFACTURING
Wenxuan Peng, Hengan Ou
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引用次数: 2

Abstract

This study investigates the deformation and fracture mechanisms of two testing methods, tension under cyclic bending (TCB) and tension under cyclic bending plus compression (TCBC) and their relationship to single point (SPIF) and double-sided (DSIF) incremental sheet forming processes. Experimental tests were carried out by using a bespoke TCBC test rig and a DSIF machine with grade 1 pure Ti samples. The results show the elongation-to-fracture has a high relevance to the bending depth and compression, which leads to detailed investigation to the stress and strain evolutions in the local bending region using finite element (FE) method. A new Gurson-Tvergaard-Needleman (GTN) model is proposed with a modified shear damage mechanism utilising experimental fracture strain loci to calibrate the Lode angle effect under low stress triaxiality. It is found the bending and reverse-bending stages correspond to different stress states and significantly affect the fracture occurrence in TCB, TCBC and SPIF, DSIF processes. For the first time, the stress paths in the plane of stress triaxiality and Lode parameter are used to reveal the transition of deformation modes from equi-biaxial to plane strain tension in SPIF and DSIF, as compared to the plane stress tension in TCB and TCBC. Using the new GTN model, the simulation gives accurate predictions to the elongation-to-fracture in TCB and TCBC, and the fracture depth in SPIF and DSIF with an error of less than 8% in comparison to the experimental results. Although there is a distinction between the equi-biaxial and uniaxial tension deformations, the study concludes that the TCB and TCBC tests provide an insight into the formability improvement and represent intrinsic deformation mechanisms of SPIF and DSIF processes, an ongoing research question, which has drawn considerable attention in recent years.

Abstract Image

循环弯曲加压缩、单点和双面增量板料成形过程中的拉伸变形机制和断裂
本文研究了循环弯曲拉伸(TCB)和循环弯曲加压缩拉伸(TCBC)两种测试方法的变形和断裂机制,以及它们与单点(SPIF)和双面(DSIF)增量板料成形过程的关系。实验测试采用定制的TCBC试验台和DSIF机,使用1级纯Ti样品进行。结果表明,拉伸到断裂与弯曲深度和压缩高度相关,因此可以采用有限元方法对局部弯曲区域的应力应变演化进行详细研究。提出了一种新的Gurson-Tvergaard-Needleman (GTN)模型,该模型采用修正的剪切损伤机制,利用实验断裂应变轨迹来校准低应力三轴下的Lode角效应。结果表明,在TCB、TCBC和SPIF、DSIF过程中,弯曲和反弯曲阶段对应于不同的应力状态,对断裂的发生有显著影响。首次利用应力三轴面应力路径和Lode参数揭示了SPIF和DSIF中变形模式从等双轴向平面应变拉伸的转变,而TCB和TCBC中变形模式为平面应力拉伸。利用新的GTN模型对TCB和TCBC的延伸至断裂以及SPIF和DSIF的断裂深度进行了准确的预测,与实验结果相比误差小于8%。尽管存在等双轴和单轴拉伸变形的区别,但该研究认为,TCB和TCBC试验提供了对成形性改善的见解,并代表了SPIF和DSIF过程的内在变形机制,这是近年来备受关注的一个正在进行的研究问题。
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来源期刊
CiteScore
25.70
自引率
10.00%
发文量
66
审稿时长
18 days
期刊介绍: The International Journal of Machine Tools and Manufacture is dedicated to advancing scientific comprehension of the fundamental mechanics involved in processes and machines utilized in the manufacturing of engineering components. While the primary focus is on metals, the journal also explores applications in composites, ceramics, and other structural or functional materials. The coverage includes a diverse range of topics: - Essential mechanics of processes involving material removal, accretion, and deformation, encompassing solid, semi-solid, or particulate forms. - Significant scientific advancements in existing or new processes and machines. - In-depth characterization of workpiece materials (structure/surfaces) through advanced techniques (e.g., SEM, EDS, TEM, EBSD, AES, Raman spectroscopy) to unveil new phenomenological aspects governing manufacturing processes. - Tool design, utilization, and comprehensive studies of failure mechanisms. - Innovative concepts of machine tools, fixtures, and tool holders supported by modeling and demonstrations relevant to manufacturing processes within the journal's scope. - Novel scientific contributions exploring interactions between the machine tool, control system, software design, and processes. - Studies elucidating specific mechanisms governing niche processes (e.g., ultra-high precision, nano/atomic level manufacturing with either mechanical or non-mechanical "tools"). - Innovative approaches, underpinned by thorough scientific analysis, addressing emerging or breakthrough processes (e.g., bio-inspired manufacturing) and/or applications (e.g., ultra-high precision optics).
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