Factors affecting evolutions of contact area formation and bonding strength in pure Cu/Cu joints produced by ultrasonic spot welding

IF 2.9 3区材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY

Science and Technology of Welding and Joining Pub Date : 2023-05-23 DOI:10.1080/13621718.2023.2213580

Kuan Hu, I-Chen Lin, Zi-Yuan Liu, Jhe-Yu Lin

引用次数: 0

Abstract

In this study, the effect of bonding surface conditions on the strength evolution of Cu/Cu joints during ultrasonic welding was investigated. Lap shear tests and microstructure characterisation revealed that contact area formation could be affected by bonding surface conditions and clamping force. That is, the fraction of contact area quickly evolved with smoother bonding surfaces, leading to a rapid strength increase to base metal fracture (1100 N of lap shear load after 1.0 s of welding). Comparatively, rough surface combinations exhibited a slow strength evolution owing to a lower fraction of contact areas. To overcome this situation, a higher clamping force was employed to facilitate contact area formation (1100 N of lap shear load after 0.5 s of welding).

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影响超声波点焊纯Cu/Cu接头接触区形成和结合强度演变的因素

在本研究中，研究了超声波焊接过程中接合表面条件对Cu/Cu接头强度演变的影响。搭接剪切试验和微观结构表征表明，接触区的形成可能受到结合表面条件和夹紧力的影响。也就是说，接触面积的份额随着更光滑的结合表面而快速演变，导致强度快速增加到基底金属断裂（焊接1.0s后1100N的搭接剪切载荷）。相比之下，由于接触面积的比例较低，粗糙表面组合表现出缓慢的强度演变。为了克服这种情况，采用更高的夹紧力来促进接触区域的形成（焊接0.5秒后的1100N搭接剪切载荷）。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Science and Technology of Welding and Joining 工程技术-材料科学：综合

CiteScore

6.10

自引率

12.10%

发文量

审稿时长

1.7 months

期刊介绍： Science and Technology of Welding and Joining is an international peer-reviewed journal covering both the basic science and applied technology of welding and joining. Its comprehensive scope encompasses all welding and joining techniques (brazing, soldering, mechanical joining, etc.) and aspects such as characterisation of heat sources, mathematical modelling of transport phenomena, weld pool solidification, phase transformations in weldments, microstructure-property relationships, welding processes, weld sensing, control and automation, neural network applications, and joining of advanced materials, including plastics and composites.