Hong Xiao, Hongwei Guo, Chunfeng Li, Dongdong Xie, Chunlei Xie, Rongqiang Liu
{"title":"Design and analysis of thermal protection and load-bearing integrated structure of the telescopic wing","authors":"Hong Xiao, Hongwei Guo, Chunfeng Li, Dongdong Xie, Chunlei Xie, Rongqiang Liu","doi":"10.1177/16878132231193865","DOIUrl":null,"url":null,"abstract":"A novel three-layer integrated structure was designed to meet the thermal-insulation and load-bearing requirements of high-speed telescopic wing aircraft. The structure consists of heat shield layer, load-bearing skeleton, and pyramid lattice structure filled with aerogel to achieve the insulation function. Sensitivity analysis of the design parameters and optimal design of the integrated structure was carried out, and the structure was optimized by using response surface method. Compared to the initial structure, the optimized structure has an equivalent thermal conductivity of 0.0276, reduced by 40%, and a relative density of 685 . 5 kg / m 3 , reduced by 3.7%. And it has a thermal conductivity that is over 20% lower than that of ceramic insulating tiles. Then, the integrated structure was regarded as a homogeneous plate, and the equivalent mechanical and thermal parameters were determined and verified by simulation and experimental results. The equivalence error was controlled within 10%. Finally, a simulation model of the telescopic wing was established. The result shows that the maximum deformation under 20 kPa surface pressure is 3.96 mm. The temperature resistance of the structure surface is up to 1500°C, and the wing internal temperature is controlled within 200°C after 1200 s of thermal loading. The results verified that the integrated structure meets the requirement of a high-speed telescopic wing.","PeriodicalId":49110,"journal":{"name":"Advances in Mechanical Engineering","volume":null,"pages":null},"PeriodicalIF":1.9000,"publicationDate":"2023-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Advances in Mechanical Engineering","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1177/16878132231193865","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, MECHANICAL","Score":null,"Total":0}
引用次数: 0
Abstract
A novel three-layer integrated structure was designed to meet the thermal-insulation and load-bearing requirements of high-speed telescopic wing aircraft. The structure consists of heat shield layer, load-bearing skeleton, and pyramid lattice structure filled with aerogel to achieve the insulation function. Sensitivity analysis of the design parameters and optimal design of the integrated structure was carried out, and the structure was optimized by using response surface method. Compared to the initial structure, the optimized structure has an equivalent thermal conductivity of 0.0276, reduced by 40%, and a relative density of 685 . 5 kg / m 3 , reduced by 3.7%. And it has a thermal conductivity that is over 20% lower than that of ceramic insulating tiles. Then, the integrated structure was regarded as a homogeneous plate, and the equivalent mechanical and thermal parameters were determined and verified by simulation and experimental results. The equivalence error was controlled within 10%. Finally, a simulation model of the telescopic wing was established. The result shows that the maximum deformation under 20 kPa surface pressure is 3.96 mm. The temperature resistance of the structure surface is up to 1500°C, and the wing internal temperature is controlled within 200°C after 1200 s of thermal loading. The results verified that the integrated structure meets the requirement of a high-speed telescopic wing.
期刊介绍:
Advances in Mechanical Engineering (AIME) is a JCR Ranked, peer-reviewed, open access journal which publishes a wide range of original research and review articles. The journal Editorial Board welcomes manuscripts in both fundamental and applied research areas, and encourages submissions which contribute novel and innovative insights to the field of mechanical engineering