Effect of Temperature, Holding Time, and Addition of Sn on Density on Metal Injection Molding Sintering Process

IF 0.9 Q3 ENGINEERING, MULTIDISCIPLINARY
W. Jannah, Danang Yudistiro, M. Asrofi, Mahros Darsin, Ahmad Rendi Maulana
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引用次数: 0

Abstract

Metal injection molding (MIM) is a metal forming technique that combines powder metallurgy with plastic injection molding. MIM is very efficient in manufacturing small and complex products in large quantities. The MIM process has four steps: mixing, debinding, injection molding, and sintering. This research was conducted to determine the effect of variations in Sn addition, temperature, and holding time on the density of Al-PP products after the sintering process. Density is mass per volume so to find out the volume of Al-PP products, the use of a 3D scanner was attempted along with the EinScan application and a mesh mixer. The Taguchi method was used for data processing to determine the influence of variations in Sn addition, temperature, and holding time on density. The calculation of the percentage contribution showed that variations in Sn addition, temperature, and holding time affected density by 47%, 21%, and 3%. Also, 2% Sn addition yielded a reasonably good microstructure formation compared to without Sn addition and 1% Sn addition, where many voids remained in the specimen (the more significant the voids, the lower the density).
金属注射成型烧结过程中温度、保温时间和Sn添加对密度的影响
金属注射成型(MIM)是粉末冶金与塑料注射成型相结合的一种金属成形技术。MIM在大批量生产小型复杂产品方面效率很高。MIM工艺有四个步骤:混合、脱脂、注射成型和烧结。本文研究了锡的添加量、温度和保温时间的变化对铝聚丙烯烧结后产品密度的影响。密度是每体积的质量,因此为了找出Al-PP产品的体积,尝试使用3D扫描仪以及EinScan应用程序和网状混合器。采用田口法进行数据处理,确定Sn添加量、温度和保温时间的变化对密度的影响。对百分比贡献的计算表明,Sn添加量、温度和保温时间的变化对密度的影响分别为47%、21%和3%。此外,与不添加Sn和添加1% Sn相比,添加2% Sn产生了相当好的微观结构,其中试样中保留了许多空洞(空洞越显著,密度越低)。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Journal of Engineering and Technological Sciences
Journal of Engineering and Technological Sciences ENGINEERING, MULTIDISCIPLINARY-
CiteScore
2.30
自引率
11.10%
发文量
77
审稿时长
24 weeks
期刊介绍: Journal of Engineering and Technological Sciences welcomes full research articles in the area of Engineering Sciences from the following subject areas: Aerospace Engineering, Biotechnology, Chemical Engineering, Civil Engineering, Electrical Engineering, Engineering Physics, Environmental Engineering, Industrial Engineering, Information Engineering, Mechanical Engineering, Material Science and Engineering, Manufacturing Processes, Microelectronics, Mining Engineering, Petroleum Engineering, and other application of physical, biological, chemical and mathematical sciences in engineering. Authors are invited to submit articles that have not been published previously and are not under consideration elsewhere.
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