Application of Soy Flour Modified Resins to Hot and Cold Pressed Veneer*

IF 1.1 4区农林科学 Q3 FORESTRY

Forest Products Journal Pub Date : 2022-07-01 DOI:10.13073/fpj-d-22-00073

O. Asafu-Adjaye, A. Alawode, B. Via, Sujit Banerjee

引用次数: 0

Abstract

Soy flour can be substituted in polymeric diphenylmethane diisocyanate (pMDI) resin for bonding plywood. Resin bleed-through is avoided by prepressing at 95°C. The boards have greater wet and dry strength than do those prepared from melamine-urea-formaldehyde (MUF) resin. Soy flour can also be substituted in emulsion polymer isocyanates for cold-press applications. The soy increases dry strength but keeps the wet strength unchanged. The optimal level of soy flour substitution is about 20 percent in all cases as determined by infrared spectroscopy.

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大豆粉改性树脂在冷热压单板中的应用*

大豆粉可以代替聚合二苯基甲烷二异氰酸酯（pMDI）树脂粘合胶合板。通过在95°C下预压可避免树脂渗出。这种板材比用三聚氰胺脲醛树脂制备的板材具有更大的干湿强度。大豆粉也可以代替乳液聚合物异氰酸酯用于冷压应用。大豆增加了干强度，但保持了湿强度不变。通过红外光谱测定，在所有情况下，大豆粉替代的最佳水平约为20%。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Forest Products Journal 工程技术-材料科学：纸与木材

CiteScore

2.10

自引率

11.10%

发文量

审稿时长

6-12 weeks

期刊介绍： Forest Products Journal (FPJ) is the source of information for industry leaders, researchers, teachers, students, and everyone interested in today''s forest products industry. The Forest Products Journal is well respected for publishing high-quality peer-reviewed technical research findings at the applied or practical level that reflect the current state of wood science and technology. Articles suitable as Technical Notes are brief notes (generally 1,200 words or less) that describe new or improved equipment or techniques; report on findings produced as by-products of major studies; or outline progress to date on long-term projects.