P‐32: Stress analysis of LED Welding Pin on Glass Based MLED Curved Light Board

Abstract

In MLED curved backlight products, studying the film layer, component peeling and failure of MLED light plates is an important research point. In this paper, simulation analysis and actual testing were conducted to address the question of whether the internal stress caused by the bending of MLED light plates would lead to LED failure. According to the simulation results, when the curvature radius of the light board is less than R630mm, the LED will be peeled off due to the internal stress caused by bending. Meanwhile, based on the simulation and test results, the applicable curvature radius range of the glass‐based MLED light board was derived and an improvement scheme for the longitudinal alignment of LEDs was proposed. In addition, reliability tests (temperature 60°C, humidity 90, 1000h) were conducted to test the cumulative effect of the internal stresses generated at the LED solder pin positions in the time axis under different radii of curvature. The results showed that no LED peeling and failure occurred in all cases, which verified that it is feasible to make curved products with Glass‐based MLED light board.