Sensitivity and Spatial Resolution for Thermal Conductivity Measurements using Non-contact Scanning Thermal Microscopy with Thermoresistive Probes under Ambient Conditions

IF 2.9 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY
Yun Zhang, Wenkai Zhu, T. Borca-Tasciuc
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引用次数: 3

Abstract

Thermoresistive probes are increasingly popular in thermal conductivity characterization using Scanning Thermal Microscopy (SThM). A systematic analysis of the thermal conductivity measurement performance (sensitivity and spatial resolution) of thermoresistive SThM probe configurations that are available commercially is of interest to practitioners. In this work, the authors developed and validated 3-Dimensional Finite Element Models (3DFEM) of non-contact SThM with self-heated thermoresistive probes under ambient conditions with the probe-sample heat transfer in transition heat conduction regime for the four types of SThM probe configurations resembling commercially available products: Wollaston wire (WW) type probe, Kelvin Nanotechnology (KNT) type probe, Doped Silicon (DS) type probe, and Nanowire (NW) type probe. These models were then used to investigate the sensitivity and spatial resolution of the WW, KNT, DS and NW type probes for thermal conductivity measurements in non-contact mode in ambient conditions. The comparison of the SThM probes performance for measuring sample thermal conductivity and for the specific operating conditions investigated here show that the NW type probe has the best spatial resolution while the DS type probe has the best thermal conductivity measurement sensitivity in the range between 2-10 W·m−1·K−1. The spatial resolution is negatively affected by large probe diameters or by the presence of the cantilever in close proximity to the sample surface which strongly affects the probe-sample heat transfer in ambient conditions. An example of probe geometry configuration optimization was illustrated for the WW probe by investigating the effect of probe wire diameter on the thermal conductivity measurement sensitivity, showing ∼20% improvement in spatial resolution at the diameter with maximum thermal conductivity measurement sensitivity.
环境条件下使用热阻探针的非接触式扫描热显微镜测量热导率的灵敏度和空间分辨率
热阻探针在使用扫描热显微镜(SThM)表征热导率方面越来越受欢迎。对商业上可用的热阻式SThM探针配置的热导率测量性能(灵敏度和空间分辨率)的系统分析是从业者感兴趣的。在这项工作中,作者开发并验证了在环境条件下具有自加热热阻探头的非接触式SThM的三维有限元模型(3DFEM),该模型具有探针-样品在过渡热传导状态下的传热,适用于四种类型的SThM探头配置,类似于市产产品:沃拉斯顿线(WW)型探头,开尔文纳米技术(KNT)型探头,掺杂硅(DS)型探头和纳米线(NW)型探头。然后使用这些模型来研究WW, KNT, DS和NW型探针在环境条件下非接触模式下的导热系数测量的灵敏度和空间分辨率。对比了SThM探针测量样品热导率的性能和所研究的特定工作条件,NW型探针具有最佳的空间分辨率,而DS型探针在2-10 W·m−1·K−1范围内具有最佳的热导率测量灵敏度。大的探针直径或靠近样品表面的悬臂的存在会对空间分辨率产生负面影响,这强烈影响探针-样品在环境条件下的传热。通过研究探针丝直径对热导率测量灵敏度的影响,举例说明了WW探针几何结构优化的一个例子,在具有最大热导率测量灵敏度的直径处,空间分辨率提高了约20%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
CiteScore
3.60
自引率
0.00%
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审稿时长
7 weeks
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