Electrodeposition of Nickel-copper alloy from aqueous solutions in the presence oforganicadditives

Abstract

On copper substrates, nickel-copper (Ni-Cu) alloy films were deposited from aqueous solutions in the presence of organic additives under galvanostatic conditions.The electrodeposition process and the electrocatalytic behavior of coated thin film were investigated using cyclic voltammetry, spectroscopic and X-ray techniques.The elctrodeposition aqueous solution was composed of nickel and copper ions with some organic additives. Organic additives were added in order to enhance the surface morphology.The coating quality and surface morphology were tested using different X-ray techniques, such as EDX, SEM, and XRD. It was found that the addition of organic additives to the electrodeposition aqueous bathsreduces the deposition rate and fracture density.