Millimetre-wave and terahertz IMPATT sources: influence of inter-carrier interactions

Q4 Engineering
Prasit Kumar Bandyopadhya, A. Biswas, A. Bhattacharjee, A. Acharyya
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引用次数: 5

Abstract

A major amount of energy of mobile electrons and holes in a semiconductor under electric field are lost due to inter-carrier collisions prior to ionising collision. This fact causes a decrease in the ionisation probability which leads to the deterioration in ionisation rates especially when the doping density is high. The effects of this phenomenon on the high frequency and noise properties of highly doped impact avalanche transit time (IMPATT) devices based on different wide bandgap (WBG) semiconductors, like 4H-SiC, Wurtzite-GaN (Wz-GaN) and type-IIb diamond (C) have been studied in this paper. Significant deteriorations in the diodes' high frequency and noise performance have been observed in the simulation results. The simulation results have been compared with the experimental data in order to validate those.
毫米波和太赫兹冲击源:载波间相互作用的影响
在电场作用下,半导体中移动电子和空穴的大量能量由于载流子间碰撞而在电离碰撞之前损失。这一事实导致电离概率的降低,从而导致电离速率的恶化,特别是当掺杂密度高时。本文研究了这一现象对基于不同宽禁带(WBG)半导体(如4H-SiC、Wurtzite-GaN (Wz-GaN)和iib型金刚石(C))的高掺杂冲击雪崩传递时间(IMPATT)器件高频和噪声特性的影响。仿真结果显示,二极管的高频性能和噪声性能明显下降。并将仿真结果与实验数据进行了比较,以验证上述方法的正确性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
International Journal of Nanoparticles
International Journal of Nanoparticles Engineering-Mechanical Engineering
CiteScore
1.60
自引率
0.00%
发文量
15
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