Effects of bubbles on manufacturing gold dendrites and silicon nanowires through the fluoride-assisted galvanic replacement reaction

IF 2.4 3区工程技术 Q3 ENGINEERING, MANUFACTURING

Journal of Manufacturing Science and Engineering-transactions of The Asme Pub Date : 2023-07-03 DOI:10.1115/1.4062878

Pee-Yew Lee, H. Huang, T. Ko, Ying-Lun Hung, Li-Yan Wu, Jianhua Fan, Yung-Sheng Lin

引用次数: 0

Abstract

Abstract The fluoride-assisted galvanic replacement reaction is a conventional method for fabricating metallic dendrites on silicon wafers. However, whether bubbles affect manufacturing metallic dendrites is unclear. This study investigated the effects of bubbles on manufacturing Au dendrites and silicon nanowires through metal-assisted chemical etching. The results of manufacture under three conditions (standard, shaking, and vacuum conditions) were compared. Synchronous growth of Au dendrites and silicon nanowires were observed on the silicon wafers. The Au dendrite deposition rate was higher than the silicon etching rate. Compared with the standard condition, the vacuum condition increased the synthesis rates of Au dendrites and silicon nanowires by 1.1 and 0.2 μm/min, respectively. Therefore, the elimination of bubbles by vacuum can considerably accelerate manufacturing Au dendrites and silicon nanowires.

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气泡对氟辅助电流置换反应制备金枝晶和硅纳米线的影响

摘要氟辅助电流置换反应是在硅片上制备金属枝晶的一种常规方法。然而，气泡是否会影响金属枝晶的制造尚不清楚。本研究研究了气泡对通过金属辅助化学蚀刻制造Au枝晶和硅纳米线的影响。比较了在三种条件（标准条件、振荡条件和真空条件）下的制造结果。在硅片上观察到Au枝晶和硅纳米线的同步生长。Au枝晶沉积速率高于硅蚀刻速率。与标准条件相比，真空条件使Au枝晶和硅纳米线的合成速率分别提高了1.1和0.2μm/min。因此，通过真空消除气泡可以显著加速Au枝晶和硅纳米线的制造。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Journal of Manufacturing Science and Engineering-transactions of The Asme 工程技术-工程：机械

CiteScore

6.80

自引率

20.00%

发文量

126

审稿时长

12 months

期刊介绍： Areas of interest including, but not limited to: Additive manufacturing; Advanced materials and processing; Assembly; Biomedical manufacturing; Bulk deformation processes (e.g., extrusion, forging, wire drawing, etc.); CAD/CAM/CAE; Computer-integrated manufacturing; Control and automation; Cyber-physical systems in manufacturing; Data science-enhanced manufacturing; Design for manufacturing; Electrical and electrochemical machining; Grinding and abrasive processes; Injection molding and other polymer fabrication processes; Inspection and quality control; Laser processes; Machine tool dynamics; Machining processes; Materials handling; Metrology; Micro- and nano-machining and processing; Modeling and simulation; Nontraditional manufacturing processes; Plant engineering and maintenance; Powder processing; Precision and ultra-precision machining; Process engineering; Process planning; Production systems optimization; Rapid prototyping and solid freeform fabrication; Robotics and flexible tooling; Sensing, monitoring, and diagnostics; Sheet and tube metal forming; Sustainable manufacturing; Tribology in manufacturing; Welding and joining