{"title":"Integrated 3D Fan-out Package of RF Microsystem and Antenna for 5G Communications","authors":"Xiang Chenhui, Wang Gang, Wang Bo, Ming Xue-fei","doi":"10.12142/ZTECOM.202003006","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":61991,"journal":{"name":"ZTE Communications","volume":"18 1","pages":"33-41"},"PeriodicalIF":0.0000,"publicationDate":"2020-11-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"ZTE Communications","FirstCategoryId":"1093","ListUrlMain":"https://doi.org/10.12142/ZTECOM.202003006","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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