An Investigation into the Roughness and Film Thickness Effects on the Interfacial Thermal Resistance

IF 2.7 3区 工程技术 Q2 ENGINEERING, MECHANICAL
Jie Lin, Mei-Jiau Huang
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引用次数: 0

Abstract

ABSTRACT The roughness and film thickness effects on the interfacial thermal resistance (ITR) are explored at two deliberately selected temperatures in use of Monte-Carlo simulation method. Particular methods are proposed to define properly the phonon emitting temperature based on the one-way deviational heat flux, and to define correctly the phonon equilibrium temperature by considering the different properties and residence times of incident, transmitted, and reflected phonons near an interface. A mixed mismatch model which allows polarization conversion is constructed and employed. The so-obtained traditional ITRs, defined based on the emitting temperature difference, and the revised ITRs, defined based on the equilibrium temperature difference, are compared with model predictions in the literature. Simulation results show that at high temperature the revised ITR decreases monotonically with increasing film thickness and at low temperature it possesses a local minimum against the interface roughness. The latter is explained by the monotonically increasing traditional ITR and monotonically decreasing ratio of the equilibrium temperature difference to emitting temperature difference with increasing roughness. Among all the studied models, only the newly proposed one can well predict the ITR for different interface roughness at low temperature. None of the models captures the monotonic decrease of ITR with film thickness at high temperature however.
粗糙度和膜厚对界面热阻影响的研究
摘要采用蒙特卡罗模拟方法,探讨了在两个精心选择的温度下,粗糙度和膜厚对界面热阻的影响。提出了基于单向偏热通量正确定义声子发射温度的特殊方法,并通过考虑界面附近入射、透射和反射声子的不同性质和停留时间来正确定义声子平衡温度。构造并采用了允许偏振转换的混合失配模型。将由此获得的基于发射温差定义的传统ITR和基于平衡温差定义的修正ITR与文献中的模型预测进行比较。模拟结果表明,在高温下,修正后的ITR随着膜厚度的增加而单调下降,而在低温下,它对界面粗糙度具有局部极小值。后者是由传统ITR的单调增加和平衡温差与发射温差的比值随着粗糙度的增加而单调减小来解释的。在所有研究的模型中,只有新提出的模型能够很好地预测低温下不同界面粗糙度的ITR。然而,没有一个模型捕捉到ITR在高温下随膜厚度的单调下降。
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来源期刊
Nanoscale and Microscale Thermophysical Engineering
Nanoscale and Microscale Thermophysical Engineering 工程技术-材料科学:表征与测试
CiteScore
5.90
自引率
2.40%
发文量
12
审稿时长
3.3 months
期刊介绍: Nanoscale and Microscale Thermophysical Engineering is a journal covering the basic science and engineering of nanoscale and microscale energy and mass transport, conversion, and storage processes. In addition, the journal addresses the uses of these principles for device and system applications in the fields of energy, environment, information, medicine, and transportation. The journal publishes both original research articles and reviews of historical accounts, latest progresses, and future directions in this rapidly advancing field. Papers deal with such topics as: transport and interactions of electrons, phonons, photons, and spins in solids, interfacial energy transport and phase change processes, microscale and nanoscale fluid and mass transport and chemical reaction, molecular-level energy transport, storage, conversion, reaction, and phase transition, near field thermal radiation and plasmonic effects, ultrafast and high spatial resolution measurements, multi length and time scale modeling and computations, processing of nanostructured materials, including composites, micro and nanoscale manufacturing, energy conversion and storage devices and systems, thermal management devices and systems, microfluidic and nanofluidic devices and systems, molecular analysis devices and systems.
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