{"title":"An Investigation into the Roughness and Film Thickness Effects on the Interfacial Thermal Resistance","authors":"Jie Lin, Mei-Jiau Huang","doi":"10.1080/15567265.2023.2240877","DOIUrl":null,"url":null,"abstract":"ABSTRACT The roughness and film thickness effects on the interfacial thermal resistance (ITR) are explored at two deliberately selected temperatures in use of Monte-Carlo simulation method. Particular methods are proposed to define properly the phonon emitting temperature based on the one-way deviational heat flux, and to define correctly the phonon equilibrium temperature by considering the different properties and residence times of incident, transmitted, and reflected phonons near an interface. A mixed mismatch model which allows polarization conversion is constructed and employed. The so-obtained traditional ITRs, defined based on the emitting temperature difference, and the revised ITRs, defined based on the equilibrium temperature difference, are compared with model predictions in the literature. Simulation results show that at high temperature the revised ITR decreases monotonically with increasing film thickness and at low temperature it possesses a local minimum against the interface roughness. The latter is explained by the monotonically increasing traditional ITR and monotonically decreasing ratio of the equilibrium temperature difference to emitting temperature difference with increasing roughness. Among all the studied models, only the newly proposed one can well predict the ITR for different interface roughness at low temperature. None of the models captures the monotonic decrease of ITR with film thickness at high temperature however.","PeriodicalId":49784,"journal":{"name":"Nanoscale and Microscale Thermophysical Engineering","volume":"27 1","pages":"149 - 167"},"PeriodicalIF":2.7000,"publicationDate":"2023-07-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Nanoscale and Microscale Thermophysical Engineering","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1080/15567265.2023.2240877","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, MECHANICAL","Score":null,"Total":0}
引用次数: 0
Abstract
ABSTRACT The roughness and film thickness effects on the interfacial thermal resistance (ITR) are explored at two deliberately selected temperatures in use of Monte-Carlo simulation method. Particular methods are proposed to define properly the phonon emitting temperature based on the one-way deviational heat flux, and to define correctly the phonon equilibrium temperature by considering the different properties and residence times of incident, transmitted, and reflected phonons near an interface. A mixed mismatch model which allows polarization conversion is constructed and employed. The so-obtained traditional ITRs, defined based on the emitting temperature difference, and the revised ITRs, defined based on the equilibrium temperature difference, are compared with model predictions in the literature. Simulation results show that at high temperature the revised ITR decreases monotonically with increasing film thickness and at low temperature it possesses a local minimum against the interface roughness. The latter is explained by the monotonically increasing traditional ITR and monotonically decreasing ratio of the equilibrium temperature difference to emitting temperature difference with increasing roughness. Among all the studied models, only the newly proposed one can well predict the ITR for different interface roughness at low temperature. None of the models captures the monotonic decrease of ITR with film thickness at high temperature however.
期刊介绍:
Nanoscale and Microscale Thermophysical Engineering is a journal covering the basic science and engineering of nanoscale and microscale energy and mass transport, conversion, and storage processes. In addition, the journal addresses the uses of these principles for device and system applications in the fields of energy, environment, information, medicine, and transportation.
The journal publishes both original research articles and reviews of historical accounts, latest progresses, and future directions in this rapidly advancing field. Papers deal with such topics as:
transport and interactions of electrons, phonons, photons, and spins in solids,
interfacial energy transport and phase change processes,
microscale and nanoscale fluid and mass transport and chemical reaction,
molecular-level energy transport, storage, conversion, reaction, and phase transition,
near field thermal radiation and plasmonic effects,
ultrafast and high spatial resolution measurements,
multi length and time scale modeling and computations,
processing of nanostructured materials, including composites,
micro and nanoscale manufacturing,
energy conversion and storage devices and systems,
thermal management devices and systems,
microfluidic and nanofluidic devices and systems,
molecular analysis devices and systems.