A New Intelligent Weak Fault Recognition Framework for Rotating Machinery

IF 0.8 4区 工程技术 Q4 ACOUSTICS
Xiaoli Zhao, M. Jia, Ding Peng, Yang Cheng, D. She, Lin Zhu, Zheng Liu
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引用次数: 1

Abstract

The presence of strong background noises makes it a challenging task to detect weak fault characteristics in vibration signals collected from rotating machinery. Thus, a two-stage intelligent weak fault recognition framework, which includes signal enhancement and intelligent recognition, is proposed in this work. The signal enhancement is accomplished via an optimized relevant variational mode decomposition (ORVMD) algorithm. Specifically, the optimal parameters is derived by combining a particle swarm optimization (PSO) algorithm and the novel defined relevant energy (Re) index. This optimized VMD algorithm can extract the principal components from the raw signals. Then, the enhanced vibration signals via the proposed ORVMD are converted into spectral signals and fed into an improved stacked auto-encoder (ISAE) algorithm for fault recognition. Experimental results demonstrate the effectiveness of the proposed algorithms and fault diagnosis framework in rotating machinery fault recognition and detection.
一种新的旋转机械弱故障智能识别框架
强背景噪声的存在使得从旋转机械振动信号中检测微弱故障特征成为一项具有挑战性的任务。为此,本文提出了一种包括信号增强和智能识别两阶段的弱故障智能识别框架。信号增强是通过优化的相关变分模态分解(ORVMD)算法来实现的。具体而言,将粒子群优化(PSO)算法与新定义的相关能量(Re)指数相结合,推导出最优参数。优化后的VMD算法可以从原始信号中提取主成分。然后,将增强后的振动信号转换为频谱信号,并输入改进的堆叠自编码器(ISAE)算法进行故障识别。实验结果证明了所提出的算法和故障诊断框架在旋转机械故障识别和检测中的有效性。
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来源期刊
International Journal of Acoustics and Vibration
International Journal of Acoustics and Vibration ACOUSTICS-ENGINEERING, MECHANICAL
CiteScore
1.60
自引率
10.00%
发文量
0
审稿时长
12 months
期刊介绍: The International Journal of Acoustics and Vibration (IJAV) is the refereed open-access journal of the International Institute of Acoustics and Vibration (IIAV). The IIAV is a non-profit international scientific society founded in 1995. The primary objective of the Institute is to advance the science of acoustics and vibration by creating an international organization that is responsive to the needs of scientists and engineers concerned with acoustics and vibration problems all around the world. Manuscripts of articles, technical notes and letters-to-the-editor should be submitted to the Editor-in-Chief via the on-line submission system. Authors wishing to submit an article need to log in on the IJAV website first. Users logged into the website are able to submit new articles, track the status of their articles already submitted, upload revised articles, responses and/or rebuttals to reviewers, figures, biographies, photographs, copyright transfer agreements, and send comments to the editor. Each time the status of an article submitted changes, the author will also be notified automatically by email. IIAV members (in good standing for at least six months) can publish in IJAV free of charge and their papers will be displayed on-line immediately after they have been edited and laid-out. Non-IIAV members will be required to pay a mandatory Article Processing Charge (APC) of $200 USD if the manuscript is accepted for publication after review. The APC fee allows IIAV to make your research freely available to all readers using the Open Access model. In addition, Non-IIAV members who pay an extra voluntary publication fee (EVPF) of $500 USD will be granted expedited publication in the IJAV Journal and their papers can be displayed on the Internet after acceptance. If the $200 USD (APC) publication fee is not honored, papers will not be published. Authors who do not pay the voluntary fixed fee of $500 USD will have their papers published but there may be a considerable delay. The English text of the papers must be of high quality. If the text submitted is of low quality the manuscript will be more than likely rejected. For authors whose first language is not English, we recommend having their manuscripts reviewed and edited prior to submission by a native English speaker with scientific expertise. There are many commercial editing services which can provide this service at a cost to the authors.
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