{"title":"New Challenges in Thermal Processing","authors":"Christian Klaus, K. Wegner, T. Rammelt, M. Ommer","doi":"10.1007/s42411-021-0443-2","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":13717,"journal":{"name":"Interceram - International Ceramic Review","volume":" ","pages":"22-25"},"PeriodicalIF":0.0000,"publicationDate":"2021-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1007/s42411-021-0443-2","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Interceram - International Ceramic Review","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1007/s42411-021-0443-2","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"Materials Science","Score":null,"Total":0}