Design and development of Cu-Al-Mn-Ni shape memory alloy coated optical fibre sensor for condition-based monitoring of physical systems

IF 2.5 Q2 ENGINEERING, INDUSTRIAL
Karthick Subramaniam, Shalini Singh, Sumeet Raikwar, Ashish Kumar Shukla, Iyamperumal Anand Palani
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引用次数: 0

Abstract

Online fault detection, isolation and recovery using smart sensors play an important role in intelligent manufacturing system. Fibre optic sensors are very interesting for condition monitoring applications due to the advantage of this technology. Here, the experimental demonstration of Cu-based shape memory alloy (SMA) coated optical fibre for temperature-based sensing applications is reported. The benefit of Cu-based SMA coated optical fibre over conventional metallic coating has been evaluated in the study. For consistent coating, an in situ fixture with a rotary drive setup has been designed and developed. Thermo optic test bench has been developed to study the actuation characteristics of the SMA coated optical fibre for varying current and voltage. Experiments were performed to investigate the light intensity in the SMA coated optical fibre at different actuation conditions. The displacement that takes place in the optical fibre due to the external temperature stimuli will create proportional intensity and wavelength shifts. The maximum average displacement of 4.9 mm has been achieved for Cu-Al-Mn-Ni coated optical fibre. Results show variation in the optical fibre signal due to heating and cooling of the fibre from the applied electrical stimulus on Cu-based SMA coating in the form of austenite to martensite transformation.

Abstract Image

用于物理系统状态监测的Cu - Al - Mn - Ni形状记忆合金涂层光纤传感器的设计与开发
摘要基于智能传感器的在线故障检测、隔离和恢复在智能制造系统中发挥着重要作用。由于该技术的优势,光纤传感器在状态监测应用中非常有趣。本文报道了用于温度传感应用的铜基形状记忆合金(SMA)涂层光纤的实验演示。研究评估了铜基SMA涂层光纤与传统金属涂层相比的优势。为了保证涂层的一致性,设计并开发了一种带有旋转驱动装置的原位夹具。为了研究SMA涂层光纤在变电流、变电压下的驱动特性,研制了热光实验台。对不同驱动条件下SMA涂层光纤的光强进行了实验研究。由于外部温度刺激,光纤中发生的位移将产生成比例的强度和波长位移。Cu - Al - Mn - Ni涂层光纤的最大平均位移为4.9 mm。结果表明,电刺激对铜基SMA涂层产生的光纤信号的加热和冷却导致光纤信号发生变化,表现为奥氏体向马氏体转变。
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来源期刊
IET Collaborative Intelligent Manufacturing
IET Collaborative Intelligent Manufacturing Engineering-Industrial and Manufacturing Engineering
CiteScore
9.10
自引率
2.40%
发文量
25
审稿时长
20 weeks
期刊介绍: IET Collaborative Intelligent Manufacturing is a Gold Open Access journal that focuses on the development of efficient and adaptive production and distribution systems. It aims to meet the ever-changing market demands by publishing original research on methodologies and techniques for the application of intelligence, data science, and emerging information and communication technologies in various aspects of manufacturing, such as design, modeling, simulation, planning, and optimization of products, processes, production, and assembly. The journal is indexed in COMPENDEX (Elsevier), Directory of Open Access Journals (DOAJ), Emerging Sources Citation Index (Clarivate Analytics), INSPEC (IET), SCOPUS (Elsevier) and Web of Science (Clarivate Analytics).
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