Determination of failure degree of 1.2 kV SiC MOSFETs after short-circuit test using an improved test setup

Shen Diao , Jun Sun , Ziwei Zhou , Zhenzhong Zhang , Adolf Schöner , Zedong Zheng , Weiwei He
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引用次数: 1

Abstract

Analysis of the short-circuit characteristics of SiC metal-oxide-semiconductor field-effect transistors (MOSFETs) is very important for their practical application. This paper studies the SiC MOSFET short-circuit characteristics with an improved test setup under different conditions. A high-current Si insulated gate bipolar transistor is used as a circuit breaker in the test circuit rather than the usual short-circuit test conducted without a circuit breaker. The test platform with a circuit breaker does not influence the calculation results regarding the short-circuit withstand time and energy, but the SiC MOSFET will switch off after failure in a very short time. In addition, the degree of failure will be limited and confined to a small area, such that the damage to the chip will be clearly observable, which is significant for short-circuit failure analysis.

使用改进的测试装置确定1.2 kV SiC MOSFET短路测试后的故障程度
分析SiC金属氧化物半导体场效应晶体管(mosfet)的短路特性对其实际应用具有重要意义。本文采用改进的测试装置研究了不同条件下SiC MOSFET的短路特性。在测试电路中使用大电流硅绝缘栅双极晶体管作为断路器,而不是通常不使用断路器进行的短路测试。带有断路器的测试平台不影响短路承受时间和能量的计算结果,但SiC MOSFET在故障后会在很短的时间内断开。此外,故障的程度将受到限制,并且局限在一个小区域内,从而可以清楚地观察到芯片的损坏情况,这对于短路故障分析具有重要意义。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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