{"title":"Design of comb-shaped single-electron slime mold circuit and its application to traveling salesman problem","authors":"T. Matsuoka, T. Oya","doi":"10.1080/17445760.2022.2140341","DOIUrl":null,"url":null,"abstract":"We propose a single-electron (SE) information processing circuit that mimics the behavior of slime mold. While SE circuits have advantages such as parallel processing and low power consumption, a suitable information processing method has not yet been established for them. Thus, we focus on the behavior of slime mold to develop a suitable information processing method. Reportedly, slime molds can solve the traveling salesman problem (TSP) if their behaviors (i.e. stretching and shrinking) are harnessed. In a simulation results, our information processing method for SE circuits mimics a series of slime mold behaviors to derive the optimal solutions for the TSP. GRAPHICAL ABSTRACT","PeriodicalId":45411,"journal":{"name":"International Journal of Parallel Emergent and Distributed Systems","volume":null,"pages":null},"PeriodicalIF":0.6000,"publicationDate":"2022-10-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Journal of Parallel Emergent and Distributed Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1080/17445760.2022.2140341","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"COMPUTER SCIENCE, THEORY & METHODS","Score":null,"Total":0}
引用次数: 0
Abstract
We propose a single-electron (SE) information processing circuit that mimics the behavior of slime mold. While SE circuits have advantages such as parallel processing and low power consumption, a suitable information processing method has not yet been established for them. Thus, we focus on the behavior of slime mold to develop a suitable information processing method. Reportedly, slime molds can solve the traveling salesman problem (TSP) if their behaviors (i.e. stretching and shrinking) are harnessed. In a simulation results, our information processing method for SE circuits mimics a series of slime mold behaviors to derive the optimal solutions for the TSP. GRAPHICAL ABSTRACT