Comparative study on minimization of conduction and switching losses in cascaded multilevel inverter via reduced switches and equal voltage source-sharing
IF 0.8 4区 工程技术Q4 ENGINEERING, ELECTRICAL & ELECTRONIC
Dania Batool, Qandeel Malik, Tila Muhammad, Adnan Umar Khan, Jonghoon Kim
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引用次数: 2
Abstract
Purpose
Multilevel inverters play a major role in the development of high-power industrial applications. In traditional low-level inverters (e.g. 2-level), the switching frequency is restricted and the harmonic spectrum of the system is hard to meet power requirements. Similarly, high-level inverters consist of a large number of switches, complex modulation techniques and complex hardware architecture, which results in high power loss and a significant amount of harmonic distortion. Furthermore, it is a must to ensure that every switch experiences the same stress of voltage and current. The purpose of this paper is to present an inverter topology with lower conduction and switching losses via reduced number of switches and equal voltage source-sharing technique.
Design/methodology/approach
Herein, the authors present a cascaded multilevel inverter having less power switches, a simple modulation technique and an equal voltage source-sharing phenomenon implementation.
Findings
The modulation technique becomes more complex when equal voltage source-sharing is to be implemented. In this study, a novel topology for the multilevel inverter with fewer switches, novel modulation technique, equal voltage source-sharing and Inductor-Capacitor-Inductor filter implementation is demonstrated to the reduce harmonic spectrum and power losses of the proposed system.
Originality/value
The nine-level inverter design is validated using software simulations and hardware prototype testing; the power losses of the proposed inverter design are elaborated and compared with the traditional approach.
期刊介绍:
Circuit World is a platform for state of the art, technical papers and editorials in the areas of electronics circuit, component, assembly, and product design, manufacture, test, and use, including quality, reliability and safety. The journal comprises the multidisciplinary study of the various theories, methodologies, technologies, processes and applications relating to todays and future electronics. Circuit World provides a comprehensive and authoritative information source for research, application and current awareness purposes.
Circuit World covers a broad range of topics, including:
• Circuit theory, design methodology, analysis and simulation
• Digital, analog, microwave and optoelectronic integrated circuits
• Semiconductors, passives, connectors and sensors
• Electronic packaging of components, assemblies and products
• PCB design technologies and processes (controlled impedance, high-speed PCBs, laminates and lamination, laser processes and drilling, moulded interconnect devices, multilayer boards, optical PCBs, single- and double-sided boards, soldering and solderable finishes)
• Design for X (including manufacturability, quality, reliability, maintainability, sustainment, safety, reuse, disposal)
• Internet of Things (IoT).