HFCVD nanostructured diamond films deposited by a combination of seeding suspensions and novel nucleation process

IF 1 4区 工程技术 Q4 ENGINEERING, MECHANICAL
D. Mukherjee, R. Polini, V. Valentini, S. Rotter, J. Mendes
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引用次数: 3

Abstract

The ultrasonic seeding of a substrate with diamond suspensions enriches the surface with nanometre-sized seeds that coalesce and form a closed conformal film during early stages of diamond growth. To get insight on seeds early growth and evaluate the seeding efficiency of different suspensions, silicon samples were exposed to diamond growth conditions before seeding; this leaves a thin carbon film on the substrate surface. Following this step samples were seeded with commercial nanodiamond suspensions, exposed again to growth conditions and characterised by SEM. Results showed that seeding suspensions played a role depending on particle size and nature of dispersing medium. Seeding density was larger and more uniform in samples pre-exposed to diamond growth conditions. The carbon film deposited during the pre-treatment improves deagglomeration of nanodiamond seeds via a more effective interaction between substrate surface and seeds. This procedure represents a viable way to grow thin conformal diamond coatings by HFCVD.
采用播散悬浮液和新型成核工艺制备HFCVD纳米结构金刚石薄膜
在金刚石生长的早期阶段,超声波播种金刚石悬浮液的衬底表面丰富了纳米大小的种子,这些种子聚集并形成一个封闭的保形膜。为了了解种子的早期生长情况并评估不同悬浮液的播种效率,在播种前将硅样品暴露在金刚石生长条件下;这在基材表面留下了一层薄薄的碳膜。在此步骤之后,将样品播种于商用纳米金刚石悬浮液中,再次暴露于生长条件下并通过扫描电镜进行表征。结果表明,种子悬浮液的作用取决于颗粒大小和分散介质的性质。在预先暴露于金刚石生长条件下的样品中,播种密度更大,更均匀。在预处理过程中沉积的碳膜通过衬底表面和种子之间更有效的相互作用改善了纳米金刚石种子的脱团聚。这一过程代表了一种可行的方法来生长薄的适形金刚石涂层HFCVD。
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来源期刊
CiteScore
1.60
自引率
25.00%
发文量
21
审稿时长
>12 weeks
期刊介绍: IJSurfSE publishes refereed quality papers in the broad field of surface science and engineering including tribology, but with a special emphasis on the research and development in friction, wear, coatings and surface modification processes such as surface treatment, cladding, machining, polishing and grinding, across multiple scales from nanoscopic to macroscopic dimensions. High-integrity and high-performance surfaces of components have become a central research area in the professional community whose aim is to develop highly reliable ultra-precision devices.
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