P. Wartenberg, Andreas Fritscher, B. Richter, G. Bunk, Steffen Damnik, Florian Schuster, D. Schlebusch, Martin Rolle, Stephan Brenner, Johannes Zeltner, U. Vogel
{"title":"3‐4: Invited Paper: A 2.5µm Dot Pitch 0.18” OLED Microdisplay on 28nm CMOS Backplane","authors":"P. Wartenberg, Andreas Fritscher, B. Richter, G. Bunk, Steffen Damnik, Florian Schuster, D. Schlebusch, Martin Rolle, Stephan Brenner, Johannes Zeltner, U. Vogel","doi":"10.1002/sdtp.16475","DOIUrl":null,"url":null,"abstract":"This paper reports on the most recent results of a 2.5um dot pitch \n0.18” OLED microdisplay which has been realized in a 28nm \nCMOS backplane. It proves the general feasibility of small‐node \nCMOS technologies for microdisplays enabling the integration of \nfar more functionality in the backplane. This has been successfully \ndemonstrated by integrating a complete frame buffer in the \nbackplane which comes with substantial benefits in terms of driving \nthe system from a low‐bandwidth data source. This results in \nsignificant power savings and smaller sized systems which \nimproves ergonomics which is another critical key parameter for \nwearables.","PeriodicalId":91069,"journal":{"name":"Digest of technical papers. SID International Symposium","volume":" ","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2023-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Digest of technical papers. SID International Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1002/sdtp.16475","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
This paper reports on the most recent results of a 2.5um dot pitch
0.18” OLED microdisplay which has been realized in a 28nm
CMOS backplane. It proves the general feasibility of small‐node
CMOS technologies for microdisplays enabling the integration of
far more functionality in the backplane. This has been successfully
demonstrated by integrating a complete frame buffer in the
backplane which comes with substantial benefits in terms of driving
the system from a low‐bandwidth data source. This results in
significant power savings and smaller sized systems which
improves ergonomics which is another critical key parameter for
wearables.