面向集成电路产业的电子电镀研究方法

Q4 Chemistry

中国科学(化学) Pub Date : 2023-07-01 DOI:10.1360/ssc-2023-0135

Lei Jin, Jiaqiang Yang, Yi Zhao, Zhaoyun Wang, Siyu Chen, Anni Zheng, Tao Song, Fang Yang, Dongping Zhan

引用次数: 0

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面向集成电路产业的电子电镀研究方法

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来源期刊

中国科学(化学) Materials Science-Materials Chemistry

CiteScore

1.20

自引率

0.00%

发文量

6112

期刊介绍： SCIENTIA SINICA Chimica is a monthly, peer-reviewed academic journal supervised by the Chinese Academy of Sciences (CAS), and co-sponsored by the Chinese Academy of Sciences and the National Natural Science Foundation of China (NSFC). Its primary mission is to encourage communication of fundamental and/or innovative, high-quality research results in the field of chemistry . The subject areas featured in this journal include: inorganic chemistry, organic chemistry, physical chemistry, polymer chemistry, chemical biology and biological chemistry, analytical chemistry, environmental chemistry, as well as chemical engineering. Manuscripts published in SCIENTIA SINICA Chimica (SSC) include Feature Articles, Reviews, Articles, Communications, and Highlights.