Frequency Response Analysis of CNT Bundle Interconnects

Q3 Engineering
M. Shefali, K. Fatima, P. Uma Sathyakam
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引用次数: 0

Abstract

ABSTRACT When carbon nanotubes (CNTs) are used in interconnects, their electrical properties are appealing as they are not affected by surface scattering when the feature size decreases. After almost two decades of research on CNT-based interconnects, it is still a question which type of CNT bundle performs better than the other. There are many contradictory reports in this regard. So, it is very important to study the frequency response of these interconnects to ascertain their actual performance and compare them. HSPICE-based circuit simulations at 20 nm and 14 nm technology nodes are carried out. Furthermore, the analysis for local, semi-global and global interconnect lengths is carried out. Results show that single-walled CNT (SWCNT) bundles have higher voltage gain and higher current gain for all lengths at both the technology nodes. These results are significant in understanding the best choice of interconnects among SWCNT bundle, MWCNT bundle and mixed CNT bundle interconnects.
CNT束互连的频率响应分析
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来源期刊
International Journal of Electronics Letters
International Journal of Electronics Letters Engineering-Electrical and Electronic Engineering
CiteScore
1.80
自引率
0.00%
发文量
42
期刊介绍: International Journal of Electronics Letters (IJEL) is a world-leading journal dedicated to the rapid dissemination of new concepts and developments across the broad and interdisciplinary field of electronics. The Journal welcomes submissions on all topics in electronics, with specific emphasis on the following areas: • power electronics • embedded systems • semiconductor devices • analogue circuits • digital electronics • microwave and millimetre-wave techniques • wireless and optical communications • sensors • instrumentation • medical electronics Papers should focus on technical applications and developing research at the cutting edge of the discipline. Proposals for special issues are encouraged, and should be discussed with the Editor-in-Chief.
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