Influence of copper layer on epoxy acrylate based solder mask surface chemistry and the effect on epoxy adhesion

IF 1.68 Q2 Dentistry

Applied Adhesion Science Pub Date : 2015-10-13 DOI:10.1186/s40563-015-0040-6

Caroline Hofmeister, Sebastian Maaß, Thorsten Fladung, Karsten Thiel, Bernd Mayer

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引用次数: 6

Abstract

The influence of the presence of copper on the network formation and the surface chemistry of an epoxy acrylate based solder mask system were investigated, with regards to the application of solder masks on copper layer. The presence of copper within the bulk volume of the solder mask was characterized by utilizing scanning electron microscopy/focused ion beam and energy dispersive X-ray analysis. The copper originates from the copper layer underneath and decreases towards the surface. Differences in the network structure were analyzed by applying infrared spectroscopy in attenuated total reflection mode, which showed no changes in the network structure due to a copper layer underneath. The surface chemistry of two solder masks with different curing agents, amine and anhydride, was investigated for differences caused by changes in the curing behavior depending on copper complex formation. Surface chemistry was analyzed by applying X-ray photoelectron spectroscopy and time of flight secondary ion mass spectrometry. Measurable differences in the surface chemistry with regards to copper content are generated due to the copper layer underneath. However, through the optical contact angle method and pull-off test, no differences concerning wetting or adhesion behavior between the solder mask and an epoxy adhesive were observed.

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铜层对环氧丙烯酸酯基阻焊膜表面化学性质的影响及对环氧树脂附着力的影响

研究了铜的存在对环氧丙烯酸酯基阻焊体系的网络形成和表面化学性质的影响，并对铜层阻焊的应用进行了研究。利用扫描电子显微镜/聚焦离子束和能量色散x射线分析表征了阻焊片体积内铜的存在。铜从下面的铜层产生，并向表面减少。利用红外光谱在衰减全反射模式下分析了网络结构的差异，发现网络结构没有因为下面有铜层而发生变化。研究了不同固化剂(胺和酸酐)对两种阻焊膜表面化学性质的影响，探讨了铜络合物形成对固化行为的影响。采用x射线光电子能谱和飞行时间二次离子质谱分析了其表面化学性质。由于下面的铜层，在铜含量方面产生了可测量的表面化学差异。然而，通过光学接触角法和拉脱试验，没有观察到阻焊剂和环氧胶粘剂在润湿和粘附行为方面的差异。

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来源期刊

Applied Adhesion Science Dentistry-Dentistry (miscellaneous)

自引率

0.00%

发文量

审稿时长

13 weeks

期刊介绍： Applied Adhesion Science focuses on practical applications of adhesives, with special emphasis in fields such as oil industry, aerospace and biomedicine. Topics related to the phenomena of adhesion and the application of adhesive materials are welcome, especially in biomedical areas such as adhesive dentistry. Both theoretical and experimental works are considered for publication. Applied Adhesion Science is a peer-reviewed open access journal published under the SpringerOpen brand. The journal''s open access policy offers a fast publication workflow whilst maintaining rigorous peer review process.