Investigation of Defect Effects on Adhesively Bonded Joint Strength Using Cohesive Zone Modeling

Q3 Engineering
Jamal-Omidi Majid, Mohammadi Suki Mohammad Reza
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引用次数: 13

Abstract

Abstract In this paper, effects of the defect in an adhesively bonded joint have been investigated using cohesive zone modeling. Consequently, a 3D finite element model of a single lap-joint is constructed and validated with experiments. Strength prediction of current model is found desirable. Accordingly, different sizes of square shape defects are imported to model in the form of changing (raised or degraded) material properties (heterogeneity) and locally delaminated areas (as inclusion/void), respectively. Joint strength is investigated and a stress analysis is carried out for adhesive layer and adherends. Obtained Results show that, defect has significant impact on the results. It is found that at constant size of defect, local delamination has more impact on bonded joint strength than the heterogeneity. Furthermore, stress analyses demonstrate that the stress field does not change in adherends by taking defects into account. However, stress values decrease with degraded material properties and joint’s strength. Through evaluation of peel and transverse shear stresses in adhesive layer it is found that there is a change of stress distribution for both types of defects. Whereas, there is a considerable stress concentration in the delaminated adhesive layer.
利用内聚区模型研究缺陷对粘接接头强度的影响
摘要本文采用内聚区建模的方法研究了粘接接头中缺陷的影响。在此基础上,建立了单搭接的三维有限元模型,并进行了试验验证。发现现有模型的强度预测是理想的。因此,不同尺寸的方形缺陷分别以改变(提高或降低)材料特性(异质性)和局部分层区域(如夹杂物/空洞)的形式导入模型。对接头强度进行了研究,并对粘接层和附着物进行了应力分析。所得结果表明,缺陷对结果有显著影响。结果表明,在缺陷尺寸一定的情况下,局部分层对接头强度的影响大于非均匀性。此外,应力分析表明,在考虑缺陷的情况下,应力场不会发生变化。应力值随材料性能和接头强度的降低而降低。通过对粘接层剥离应力和横向剪应力的评估,发现两种缺陷的应力分布都有变化。然而,在分层胶粘剂层中存在相当大的应力集中。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Strojnicky Casopis
Strojnicky Casopis Engineering-Mechanical Engineering
CiteScore
2.00
自引率
0.00%
发文量
33
审稿时长
14 weeks
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