Ultrathin internal dielectric electrostatic actuator for reduced pull-in voltage and bidirectional actuation

IF 2.4 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Satish K. Verma, Bhaskar Mitra
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Abstract

Direction and analog deflection control, as well as low voltage digital switching are the most desirable attributes in electrostatic actuators for current MEMS applications. In this work we show how internal dielectric transduction can be used to reduce pull-in voltages without reducing the air gap, and to effect bi-directional actuation. The actuator is a metal–dielectric–metal sandwich. For hybrid actuation to achieve reduced pull-in, the device has a thick bottom metal and a thin top metal, while for the upward actuator the device has a thick top metal and a thin bottom metal. An out-of-plane deflection of 108 nm is achieved using 5 V applied voltage for the upward actuator, while the hybrid actuator shows over 50% reduction in pull-in voltage from 1.26 V to 0.62 V.
超薄内部电介质静电致动器,用于降低引入电压和双向驱动
方向和模拟偏转控制以及低压数字开关是当前MEMS应用中静电致动器最理想的特性。在这项工作中,我们展示了如何使用内部介电转导来降低拉入电压而不减少气隙,并影响双向驱动。驱动器是金属-介电-金属夹层结构。对于实现减少拉入的混合驱动,该装置具有厚的底部金属和薄的顶部金属,而对于向上驱动装置,该装置具有厚的顶部金属和薄的底部金属。使用5 V的电压,向上执行器实现了108 nm的面外偏转,而混合执行器的拉入电压从1.26 V降低到0.62 V,降低了50%以上。
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来源期刊
Journal of Micromechanics and Microengineering
Journal of Micromechanics and Microengineering 工程技术-材料科学:综合
CiteScore
4.50
自引率
4.30%
发文量
136
审稿时长
2.8 months
期刊介绍: Journal of Micromechanics and Microengineering (JMM) primarily covers experimental work, however relevant modelling papers are considered where supported by experimental data. The journal is focussed on all aspects of: -nano- and micro- mechanical systems -nano- and micro- electomechanical systems -nano- and micro- electrical and mechatronic systems -nano- and micro- engineering -nano- and micro- scale science Please note that we do not publish materials papers with no obvious application or link to nano- or micro-engineering. Below are some examples of the topics that are included within the scope of the journal: -MEMS and NEMS: Including sensors, optical MEMS/NEMS, RF MEMS/NEMS, etc. -Fabrication techniques and manufacturing: Including micromachining, etching, lithography, deposition, patterning, self-assembly, 3d printing, inkjet printing. -Packaging and Integration technologies. -Materials, testing, and reliability. -Micro- and nano-fluidics: Including optofluidics, acoustofluidics, droplets, microreactors, organ-on-a-chip. -Lab-on-a-chip and micro- and nano-total analysis systems. -Biomedical systems and devices: Including bio MEMS, biosensors, assays, organ-on-a-chip, drug delivery, cells, biointerfaces. -Energy and power: Including power MEMS/NEMS, energy harvesters, actuators, microbatteries. -Electronics: Including flexible electronics, wearable electronics, interface electronics. -Optical systems. -Robotics.
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