Implementation of High-Speed Serial I/O using Xilinx Tools in FPGA

Q2 Engineering
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Abstract

The I/O (Input Output) module conveys the information between I/O device and processor. I/O devices are majorly of two types: Parallel I/O and Serial I/O. Parallel I/O performs multiple I/O operations simultaneously. Due to this speed and higher bandwidths are achieved, but the usage of parallel I/O devices is decreasing as time progresses because it involves complex design due to the usage of multiple wires for the transmission hence only limited to usage in shorter distances. It also uses a greater number of pins compared to serial I/O for the same number of data bits which makes its usage problematic in higher level devices. Serial I/O transmits individual data bits sequentially. It uses lesser number of lines for data transmission thereby reducing the design complexity. Since, the data transmission is sequential the signal delay increases. Thus, this project aims to develop a protocol which achieves High Speed Serial I/O which helps to increase the data rate from Mbps to Gbps, decrease the design complexity, to design hardware using fewer number of pins on PCB and reduce signal delay to maximum extent possible
Xilinx工具在FPGA中的高速串行I/O实现
I/O(输入输出)模块在I/O设备和处理器之间传递信息。I/O设备主要有两种类型:并行I/O和串行I/O。并行I/O同时执行多个I/O操作。由于这种速度和更高的带宽,但并行I/O设备的使用随着时间的推移而减少,因为它涉及复杂的设计,因为传输使用多条导线,因此仅限于在较短距离内使用。对于相同数量的数据位,与串行I/O相比,它还使用了更多的引脚,这使得它在更高级别的设备中的使用存在问题。串行I/O按顺序传输各个数据位。它使用较少数量的线路进行数据传输,从而降低了设计复杂性。由于数据传输是顺序的,因此信号延迟增加。因此,本项目旨在开发一种实现高速串行I/O的协议,该协议有助于将数据速率从Mbps提高到Gbps,降低设计复杂性,并在PCB上使用更少的引脚来设计硬件,并最大限度地减少信号延迟
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