Research on the relationship between time-dependent strains and delamination of plastic packaged devices at polymer/copper interface under thermal-hygro environments

IF 2.3 4区材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY

Modelling and Simulation in Materials Science and Engineering Pub Date : 2022-06-14 DOI:10.1088/1361-651X/ac788b

Xinghua Shi, Yuanying Qiu, Jieyu Zhang, F. Jia, Hongbo Ma

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引用次数: 2

Abstract

Delamination of polymer/metal interfaces has a destructive effect on plastic packaged devices containing thin layered structures. The physics mechanisms of the delamination inside the microstructure devices are not well understood and difficult to reveal. In order to get a deeper understanding of strain variations at the interface between the viscoelastic polymer and other elastic metal bases under a thermal-hygro environment, the following researches are conducted. Firstly, by combining the generalized Maxwell model and the hygro-mechanical strain equation of bi-layer plate, the equation set for hygro-mechanical strain at the interface of bi-layer plate is established considering the viscoelasticity of epoxy resins. Secondly, two bi-layer plate test pieces are made using elastic copper plates and two different types of viscoelastic epoxy resins (diglycidyl ether of bisphenol F (DGEBF) and Cycloaliphatic epoxy resins), and the normal strains at the interface of the two bi-layer plates under a thermal-hygro environment are measured by strain gauges sealed between the epoxy resin layer and the copper plate. Thirdly, by substituting the thermal strain results into the polynomial equations for thermo-mechanical strain at the bi-layer plate interface, the coefficients of thermal expansion of the two epoxy resins at different temperatures are obtained. Finally, multi-parameter fitting of the interface hygro-mechanical strain curves are drawn through programming in MATLAB software based on the genetic algorithm, and the shear modulus and relaxation time of the two viscoelastic epoxy resins are obtained. This paper’s experiment and calculation results reveal the relationship between time-dependent strain and delamination of plastic packaged devices at polymer/copper interface under a thermal-hygro environment, and provide a valuable reference to improve the reliability of plastic packaged devices.

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湿热环境下塑料封装器件在聚合物/铜界面的时间相关应变与分层关系的研究

聚合物/金属界面的分层对含有薄层结构的塑料封装器件具有破坏性影响。微观结构器件内部分层的物理机制尚不清楚，也难以揭示。为了更深入地了解热湿环境下粘弹性聚合物与其他弹性金属基界面处的应变变化，进行了以下研究。首先，将广义Maxwell模型与双层板的水力学应变方程相结合，建立考虑环氧树脂粘弹性的双层板界面水力学应变方程集;其次，采用弹性铜板和两种不同类型的粘弹性环氧树脂(双酚F二缩水甘油酯(DGEBF)和环脂肪族环氧树脂)制成两层双层板试件，通过密封在环氧树脂层和铜板之间的应变片测量热湿环境下两层双层板界面处的法向应变。第三，将热应变结果代入双层板界面处的热-机械应变多项式方程，得到两种环氧树脂在不同温度下的热膨胀系数。最后，基于遗传算法，通过MATLAB软件编程绘制界面水-力学应变曲线的多参数拟合，得到两种粘弹性环氧树脂的剪切模量和松弛时间。本文的实验和计算结果揭示了热湿环境下聚合物/铜界面塑料封装器件的时间应变与分层之间的关系，为提高塑料封装器件的可靠性提供了有价值的参考。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Modelling and Simulation in Materials Science and Engineering 工程技术-材料科学：综合

CiteScore

3.30

自引率

5.60%

发文量

审稿时长

1.7 months

期刊介绍： Serving the multidisciplinary materials community, the journal aims to publish new research work that advances the understanding and prediction of material behaviour at scales from atomistic to macroscopic through modelling and simulation. Subject coverage: Modelling and/or simulation across materials science that emphasizes fundamental materials issues advancing the understanding and prediction of material behaviour. Interdisciplinary research that tackles challenging and complex materials problems where the governing phenomena may span different scales of materials behaviour, with an emphasis on the development of quantitative approaches to explain and predict experimental observations. Material processing that advances the fundamental materials science and engineering underpinning the connection between processing and properties. Covering all classes of materials, and mechanical, microstructural, electronic, chemical, biological, and optical properties.