Effect of Sintering Temperature on the Microstructure and Properties of High-Strength and Highly Conductive 5 wt.% ZrB2/Cu Composite

IF 0.9 4区 材料科学 Q3 MATERIALS SCIENCE, CERAMICS
Zhang Peng, Wang Chenchen, Zhou Shengfeng, Guo Baisong, Zhang Zhiguo, Yu Zhentao, Li Wei
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引用次数: 1

Abstract

Cu matrix composites have received increased attention in a wide industrial area because of their excellent mechanical properties and good electrical and thermal conductivity. However, the addition of general ceramic reinforcements often leads to a marked reduction in electrical conductivity for Cu matrix composites. In this study, the ZrB2-reinforced Cu composites have been developed to overcome this drawback since these metal borides possess relatively high electrical conductivity. The 5 wt.% ZrB2/Cu composites were prepared using hot-pressed sintering techniques at varying temperatures from 760 to 920°C. The influence of sintering temperature on the microstructure, relative density, and mechanical and electrical properties was examined. The results of the SEM observation show that ZrB2 particles are seamlessly integrated into the Cu matrix for all ZrB2/Cu composites. The average grain size of the Cu matrix increases from 360 to 980 nm with the increase of the sintering temperature. The increase in sintering temperature also leads to the surface porosity decrease from 1.4 to 0.4%. The relative density and electric conductivity of the composites increase at the same time as the sintering temperature increases. However, microhardness increases and decreases, with a maximum value of 92 HV0.2 achieved at 840°C. The elastic modulus and nanohardness maps determined from the nanoindentation indicate that the reinforced ZrB2 particles demonstrate the highest values for elastic modulus (340–500 GPa) and nanohardness (30–48 GPa). At the same time, the Cu matrix possesses a modulus of 100–200 GPa and nanohardness of about 10 GPa. TEM observation confirmed that the sintering temperature exhibits little influence on the interface reaction between ZrB2 and Cu. Both sharp interface and interface with amorphous transition layer are observed. The variation of microhardness is mainly due to the strengthening of grain refinement and to the mismatch of the thermal expansion coefficients. The above results can provide further insights into the deeper understanding of the role of sintering temperature during hot-pressed sintering.

Abstract Image

烧结温度对高强高导电5 wt % ZrB2/Cu复合材料组织和性能的影响
铜基复合材料因其优异的力学性能和良好的导电性和导热性而受到广泛的工业领域的关注。然而,普通陶瓷增强剂的加入往往会导致铜基复合材料电导率的显著降低。在本研究中,开发了zrb2增强Cu复合材料来克服这一缺点,因为这些金属硼化物具有相对较高的导电性。采用热压烧结技术,在760 ~ 920℃范围内制备了5 wt.% ZrB2/Cu复合材料。考察了烧结温度对合金显微组织、相对密度和力学性能的影响。SEM观察结果表明,ZrB2颗粒与Cu基体无缝结合。随着烧结温度的升高,Cu基体的平均晶粒尺寸从360 nm增大到980 nm。随着烧结温度的升高,表面孔隙率由1.4%下降到0.4%。复合材料的相对密度和电导率随烧结温度的升高而增大。然而,显微硬度有增有减,在840℃时达到最大值92 HV0.2。由纳米压痕测定的弹性模量和纳米硬度图表明,增强ZrB2颗粒的弹性模量(340 ~ 500 GPa)和纳米硬度(30 ~ 48 GPa)最高。同时,Cu基体的模量为100 ~ 200 GPa,纳米硬度约为10 GPa。TEM观察证实,烧结温度对ZrB2与Cu的界面反应影响不大。同时观察到尖锐界面和非晶过渡层界面。显微硬度的变化主要是由于晶粒细化的强化和热膨胀系数的失配所致。以上结果可以为深入了解烧结温度在热压烧结过程中的作用提供进一步的见解。
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来源期刊
Powder Metallurgy and Metal Ceramics
Powder Metallurgy and Metal Ceramics 工程技术-材料科学:硅酸盐
CiteScore
1.90
自引率
20.00%
发文量
43
审稿时长
6-12 weeks
期刊介绍: Powder Metallurgy and Metal Ceramics covers topics of the theory, manufacturing technology, and properties of powder; technology of forming processes; the technology of sintering, heat treatment, and thermo-chemical treatment; properties of sintered materials; and testing methods.
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