Shock and impact reliability of electronic assemblies with perimeter vs full array layouts: A numerical comparative study

IF 1.7 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY

Journal of the Mechanical Behavior of Materials Pub Date : 2022-01-01 DOI:10.1515/jmbm-2022-0058

Mohammad A. Gharaibeh

引用次数: 4

Abstract

Abstract This study aims to assess the effect of the solder joint array layouts, including full and peripheral designs, on the mechanical response and reliability of electronic packages subjected to shock and impact loadings. Linear and nonlinear finite element simulations using the global-local modeling technique are employed to perform the analysis. Several peripheral array configurations are considered and compared to the full array systems. The results showed that, for optimum electronic package designs in terms of reliability and cost, it is highly recommended to use peripheral packages having three or four rows of solder interconnects in electronic systems under shock and impact loadings.

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周边布局与全阵列布局电子组件的冲击可靠性：数值比较研究

摘要本研究旨在评估焊点阵列布局（包括完整和外围设计）对电子封装在冲击和冲击载荷下的机械响应和可靠性的影响。采用全局局部建模技术进行线性和非线性有限元模拟来进行分析。考虑了几种外围阵列配置，并将其与全阵列系统进行了比较。结果表明，为了在可靠性和成本方面实现最佳电子封装设计，强烈建议在冲击和冲击载荷下的电子系统中使用具有三排或四排焊料互连的外围封装。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Journal of the Mechanical Behavior of Materials Materials Science-Materials Science (miscellaneous)

CiteScore

3.00

自引率

11.10%

发文量

审稿时长

30 weeks

期刊介绍： The journal focuses on the micromechanics and nanomechanics of materials, the relationship between structure and mechanical properties, material instabilities and fracture, as well as size effects and length/time scale transitions. Articles on cutting edge theory, simulations and experiments – used as tools for revealing novel material properties and designing new devices for structural, thermo-chemo-mechanical, and opto-electro-mechanical applications – are encouraged. Synthesis/processing and related traditional mechanics/materials science themes are not within the scope of JMBM. The Editorial Board also organizes topical issues on emerging areas by invitation. Topics Metals and Alloys Ceramics and Glasses Soils and Geomaterials Concrete and Cementitious Materials Polymers and Composites Wood and Paper Elastomers and Biomaterials Liquid Crystals and Suspensions Electromagnetic and Optoelectronic Materials High-energy Density Storage Materials Monument Restoration and Cultural Heritage Preservation Materials Nanomaterials Complex and Emerging Materials.