S. Lalléchère, J. Nebhen, Yang Liu, George Chan, G. Fontgalland, W. Rahajandraibe, F. Wan, B. Ravelo
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引用次数: 1
Abstract
Purpose
The purpose of this paper is to study, a bridged-T topology with inductorless passive network used as a bandpass (BP) negative group delay (NGD) function.
Design/methodology/approach
The BP NGD topology under study is composed of an inductorless passive resistive capacitive network. The circuit analysis is elaborated from the equivalent impedance matrix. Then, the analytical model of the C-shunt bridged-T topology voltage transfer function is established. The BP NGD analysis of the considered topology is developed in function of the bridged-T parameters. The NGD properties and characterizations of the proposed topology are analytically expressed. Moreover, the relevance of the BP NGD theory is verified with the design and fabrication of surface mounted device components-based proof-of-concept (PoC).
Findings
From measurement results, the BP NGD network with −151 ns at the center frequency of 1 MHz over −6.6 dB attenuation is in very good agreement with the C-shunt bridged-T PoC.
Originality/value
This paper develops a mathematical modeling theory and measurement of a C-shunt bridged-T network circuit.
期刊介绍:
Circuit World is a platform for state of the art, technical papers and editorials in the areas of electronics circuit, component, assembly, and product design, manufacture, test, and use, including quality, reliability and safety. The journal comprises the multidisciplinary study of the various theories, methodologies, technologies, processes and applications relating to todays and future electronics. Circuit World provides a comprehensive and authoritative information source for research, application and current awareness purposes.
Circuit World covers a broad range of topics, including:
• Circuit theory, design methodology, analysis and simulation
• Digital, analog, microwave and optoelectronic integrated circuits
• Semiconductors, passives, connectors and sensors
• Electronic packaging of components, assemblies and products
• PCB design technologies and processes (controlled impedance, high-speed PCBs, laminates and lamination, laser processes and drilling, moulded interconnect devices, multilayer boards, optical PCBs, single- and double-sided boards, soldering and solderable finishes)
• Design for X (including manufacturability, quality, reliability, maintainability, sustainment, safety, reuse, disposal)
• Internet of Things (IoT).