{"title":"How double dynamics affects the large deformation and fracture behaviors of soft materials","authors":"Kunpeng Cui, J. Gong","doi":"10.1122/8.0000438","DOIUrl":null,"url":null,"abstract":"Numerous mechanically strong and tough soft materials comprising of polymer networks have been developed over the last two decades, motivated by new high-tech applications in engineering and bio-related fields. These materials are characterized by their dynamic complexities and large deformation behaviors. In this Review, we focus on how chain dynamics affects the large deformation and fracture behaviors of soft materials. To favor readers without a rheology background, first we review the linear rheology behaviors of several simple networks. We show that, by playing with the physical entanglement, chemical cross-linking, and physical association of the building polymers, a very rich panel of dynamic responses can be obtained. Then, we show examples of how chain dynamics affects the deformation and fracture behaviors of dually cross-linked hydrogels having chemical cross-linkers and physical bonds. We also provide examples on the unique deformation behavior of physical double-network gels made from triblock polymers. Thereafter, examples of the influence of chain dynamics on the crack initiation and growth behaviors are presented. We show that even for chemically cross-linked double-network hydrogels that exhibit elastic behaviors in a common deformation window, the chain dynamics influences the damage zone size at the crack tip. Finally, we conclude this Review by proposing several directions for future research.","PeriodicalId":16991,"journal":{"name":"Journal of Rheology","volume":" ","pages":""},"PeriodicalIF":3.0000,"publicationDate":"2022-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Rheology","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1122/8.0000438","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"MECHANICS","Score":null,"Total":0}
引用次数: 5
Abstract
Numerous mechanically strong and tough soft materials comprising of polymer networks have been developed over the last two decades, motivated by new high-tech applications in engineering and bio-related fields. These materials are characterized by their dynamic complexities and large deformation behaviors. In this Review, we focus on how chain dynamics affects the large deformation and fracture behaviors of soft materials. To favor readers without a rheology background, first we review the linear rheology behaviors of several simple networks. We show that, by playing with the physical entanglement, chemical cross-linking, and physical association of the building polymers, a very rich panel of dynamic responses can be obtained. Then, we show examples of how chain dynamics affects the deformation and fracture behaviors of dually cross-linked hydrogels having chemical cross-linkers and physical bonds. We also provide examples on the unique deformation behavior of physical double-network gels made from triblock polymers. Thereafter, examples of the influence of chain dynamics on the crack initiation and growth behaviors are presented. We show that even for chemically cross-linked double-network hydrogels that exhibit elastic behaviors in a common deformation window, the chain dynamics influences the damage zone size at the crack tip. Finally, we conclude this Review by proposing several directions for future research.
期刊介绍:
The Journal of Rheology, formerly the Transactions of The Society of Rheology, is published six times per year by The Society of Rheology, a member society of the American Institute of Physics, through AIP Publishing. It provides in-depth interdisciplinary coverage of theoretical and experimental issues drawn from industry and academia. The Journal of Rheology is published for professionals and students in chemistry, physics, engineering, material science, and mathematics.