A non-uniform strip-array decoupling structure of the MIMO antenna-arrays for the DSRC application

Q3 Engineering
Yi-Jung Tang, Renjing Gao
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引用次数: 0

Abstract

ABSTRACT In this paper, a non-uniform strip-array decoupling structure (SADS) of the MIMO antenna-arrays for the dedicated short-range communication (DSRC) applications in intelligent transportation systems (ITS) is presented. The SADS is composed of metal strips with non-uniform longitudinal layout, which has a simple strip-array geometry, low design and fabrication complexity, and easy to be applied to the design domain without destroying the original antenna-array. The design of the strip thickness, strip-array layout and number of strips is realised by the proposed simple and effective optimisation method. The mutual coupling between the elements can be effectively suppressed to less than −32 dB by the proposed structure in the required bandwidth (5.795 GHz~5.815 GHz). The results show that, compared with the no-strip and uniform SADS, the non-uniform SADS can improve the maximum mutual coupling reduction by 23 dB and 13 dB, respectively. Both the simulated and measured results verify the effectiveness of the proposed SADS, which makes it very suitable for the large-scale MIMO antenna-arrays.
用于DSRC应用的MIMO天线阵列的非均匀条形阵列解耦结构
提出了一种用于智能交通系统(ITS)中专用短距离通信(DSRC)的MIMO天线阵列非均匀条形阵列解耦结构(SADS)。SADS由纵向不均匀布局的金属条构成,具有条形阵几何结构简单、设计和制造复杂度低、易于应用于设计领域而不破坏原有天线阵的特点。采用简单有效的优化方法实现了带钢厚度、带钢阵列布局和带钢数量的优化设计。在所需带宽(5.795 GHz~5.815 GHz)范围内,该结构可有效地将元件间的相互耦合抑制在- 32 dB以下。结果表明,与无条形和均匀条形SADS相比,非均匀条形SADS可将最大互耦降低幅度分别提高23 dB和13 dB。仿真和实测结果验证了该方法的有效性,使其非常适用于大规模MIMO天线阵。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
International Journal of Electronics Letters
International Journal of Electronics Letters Engineering-Electrical and Electronic Engineering
CiteScore
1.80
自引率
0.00%
发文量
42
期刊介绍: International Journal of Electronics Letters (IJEL) is a world-leading journal dedicated to the rapid dissemination of new concepts and developments across the broad and interdisciplinary field of electronics. The Journal welcomes submissions on all topics in electronics, with specific emphasis on the following areas: • power electronics • embedded systems • semiconductor devices • analogue circuits • digital electronics • microwave and millimetre-wave techniques • wireless and optical communications • sensors • instrumentation • medical electronics Papers should focus on technical applications and developing research at the cutting edge of the discipline. Proposals for special issues are encouraged, and should be discussed with the Editor-in-Chief.
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