Microstructure and properties of ultrasonic-assisted gallium-based alloys for room-temperature bonding of Cu/Cu

IF 1.2 4区材料科学 Q4 MATERIALS SCIENCE, MULTIDISCIPLINARY

Philosophical Magazine Letters Pub Date : 2023-07-07 DOI:10.1080/09500839.2023.2230955

Qu Yingying, Fang Qiuyue, Zhao Liang, Guo Zuoxing

引用次数: 1

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室温Cu/Cu键合用超声辅助镓基合金的组织与性能

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Philosophical Magazine Letters 物理-物理：凝聚态物理

CiteScore

2.60

自引率

0.00%

发文量

审稿时长

2.7 months

期刊介绍： Philosophical Magazine Letters is the rapid communications part of the highly respected Philosophical Magazine, which was first published in 1798. Its Editors consider for publication short and timely contributions in the field of condensed matter describing original results, theories and concepts relating to the structure and properties of crystalline materials, ceramics, polymers, glasses, amorphous films, composites and soft matter. Articles emphasizing experimental, theoretical and modelling studies on solids, especially those that interpret behaviour on a microscopic, atomic or electronic scale, are particularly appropriate. Manuscripts are considered on the strict condition that they have been submitted only to Philosophical Magazine Letters , that they have not been published already, and that they are not under consideration for publication elsewhere.