R. Saravanan, S. Vijayshankar, S. Sathyaseelan, K. Suresh
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引用次数: 2
Abstract
Purpose
This paper aims to propose Hidden Converter (H-Converter) combined with dual port 3Ø inverter for energy storage application to produce wide range of voltage. Some of the application required wide range of voltages, but problem from E-chopper is either boost or buck mode of operations, both modes are not possible. To overcome this drawback, H-Converter is combined with dual port 3Ø inverter controlled by carrier-based pulse width modulation (CB-PWM) technique is added with zero sequence injection.
Design/methodology/approach
Hidden converter is a bidirectional DC-DC chopper used to convert fixed DC to variable DC and vice versa in both buck and boost modes of operations. Dual port inverter is combined with hidden DC-DC converter can produce wide range of voltages.
Findings
The bidirectional DC-AC converter requires less power for processing and consumes less power losses by using modest carrier built- pulse width modulation scheme through proposed zero structure addition.
Originality/value
By using this proposed strategy H-Converter can produce wide range of voltage in both the sides and mostly power is processed in the 3Ø inverter with a one stage conversion with less power loss. As a result, with one stage power conversion has more efficiency because of less power loss. This proposed converter has designed by analysis, and the real time result is tested in an experiment.
期刊介绍:
Circuit World is a platform for state of the art, technical papers and editorials in the areas of electronics circuit, component, assembly, and product design, manufacture, test, and use, including quality, reliability and safety. The journal comprises the multidisciplinary study of the various theories, methodologies, technologies, processes and applications relating to todays and future electronics. Circuit World provides a comprehensive and authoritative information source for research, application and current awareness purposes.
Circuit World covers a broad range of topics, including:
• Circuit theory, design methodology, analysis and simulation
• Digital, analog, microwave and optoelectronic integrated circuits
• Semiconductors, passives, connectors and sensors
• Electronic packaging of components, assemblies and products
• PCB design technologies and processes (controlled impedance, high-speed PCBs, laminates and lamination, laser processes and drilling, moulded interconnect devices, multilayer boards, optical PCBs, single- and double-sided boards, soldering and solderable finishes)
• Design for X (including manufacturability, quality, reliability, maintainability, sustainment, safety, reuse, disposal)
• Internet of Things (IoT).