Influence of the Process Parameters on the Microhardness and the Wear Resistance of Friction Stir Processed H65 Copper Alloy

IF 0.9 Q3 ENGINEERING, MULTIDISCIPLINARY
X. Ge, I. Kolupaev, W. Song, Di Jiang, J. Pu, Hongfeng Wang, Yuan Chu
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Abstract

Friction stir processing (FSP) was used to modify a larger-size surface of H65 copper alloy. The influence of the traverse speed and the rotation speed on the microstructure, the microhardness and the wear resistance of the modified surface were analyzed. The wear mechanism of the modified H65 copper alloy was revealed. The results indicate that the grain size was greatly refined after FSP compared with the parent metal and that the grain size increased with the increment of the rotation speed. The average microhardness of the modified surface was higher than that of the parent metal. The average microhardness had a highest value of 174.13 HV when the traverse speed was 200 mm/min and the rotation speed was 200 rpm, i.e., 21% higher than that of the parent metal. The average microhardness decreased with the increase of the rotation speed. When the traverse speed was 200 mm/min and the rotation speed was 600 rpm, the average friction coefficient of the modified surface was the smallest (0.3213), which was lower than that of the parent metal (0.3810). The wear mechanism of the H65 copper alloy modified by FSP was mainly adhesive wear accompanied by local abrasive wear.
工艺参数对搅拌摩擦加工H65铜合金显微硬度和耐磨性的影响
采用搅拌摩擦法(FSP)对H65铜合金进行了大尺寸表面改性。分析了横移速度和转速对改性表面显微组织、显微硬度和耐磨性的影响。揭示了改性H65铜合金的磨损机理。结果表明:与母材相比,FSP后晶粒尺寸明显细化,晶粒尺寸随转速的增加而增大;改性后表面的平均显微硬度高于母材。当横移速度为200 mm/min,转速为200 rpm时,平均显微硬度最高,为174.13 HV,比母材硬度高21%。平均显微硬度随转速的增加而降低。当横移速度为200 mm/min,转速为600 rpm时,改性表面的平均摩擦系数最小(0.3213),低于母材的平均摩擦系数(0.3810)。FSP改性H65铜合金的磨损机制以黏着磨损为主,并伴有局部磨粒磨损。
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来源期刊
Journal of Engineering and Technological Sciences
Journal of Engineering and Technological Sciences ENGINEERING, MULTIDISCIPLINARY-
CiteScore
2.30
自引率
11.10%
发文量
77
审稿时长
24 weeks
期刊介绍: Journal of Engineering and Technological Sciences welcomes full research articles in the area of Engineering Sciences from the following subject areas: Aerospace Engineering, Biotechnology, Chemical Engineering, Civil Engineering, Electrical Engineering, Engineering Physics, Environmental Engineering, Industrial Engineering, Information Engineering, Mechanical Engineering, Material Science and Engineering, Manufacturing Processes, Microelectronics, Mining Engineering, Petroleum Engineering, and other application of physical, biological, chemical and mathematical sciences in engineering. Authors are invited to submit articles that have not been published previously and are not under consideration elsewhere.
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