Studi Evolusi Struktur pada Deposisi Tembaga Dalam Substrat Silikon Dengan Metode Dinamika Molekuler

IF 0.3 Q4 MATHEMATICS
A. Hidayat
{"title":"Studi Evolusi Struktur pada Deposisi Tembaga Dalam Substrat Silikon Dengan Metode Dinamika Molekuler","authors":"A. Hidayat","doi":"10.29313/JMTM.V18I1.4565","DOIUrl":null,"url":null,"abstract":"Abstrak. Metode dinamika molekuler digunakan untuk mempelajari deposisi atom tembaga (Cu) pada substrat silikon (Si). Interaksi atom-atom Si-Si, Cu-Cu, dan Cu-Si masing-masing dideskripsikan dengan potensial interatomik Tersoff, MEAM, dan Morse. Ensembel NVE dan termostat Berendsen digunakan dalam simulasi ini. Kemudian diinvestigasi pengaruh parameter kecepatan awal dan laju deposisi terhadap persentase struktur amorf, fungsi distribusi radial (RDF), dan bilangan koordinasi. Hasil simulasi menunjukkan perbedaan yang signifikan terhadap persentase struktur amorf pada parameter yang bervariasi. Investigasi pasca-simulasi menunjukkan variasi pada nilai RDF dan bilangan koordinasi. Kata kunci: Metode dinamika molekuler, evolusi struktur, fungsi distribusi radial, bilangan koordinasi Study of Structure Evolution of Copper Deposition on Silicon Substrate using Molecular Dynamics Method Abstract.  The Molecular dynamics method was used to study the deposition of copper (Cu) atoms onto silicon (Si) substrate. The interaction of Si-Si Cu-Cu, and Cu-Si atoms were described by Tersoff, MEAM, and Morse interatomic potentials respectively. NVE ensemble and Berendsen thermostat was used in this simulation. The effect of initial velocity and deposition rate on the percentage of amorphous structure, radial distribution function (RDF), and coordination number was investigated. The result showed significant differences of amorphous structure percentage at varied parameters. Post-simulation investigation showed variation in RDF and coordination number. Keywords: Molecular dynamics method, structure evolution, radial distribution function, coordination number","PeriodicalId":43733,"journal":{"name":"Matematika","volume":" ","pages":""},"PeriodicalIF":0.3000,"publicationDate":"2019-05-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Matematika","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.29313/JMTM.V18I1.4565","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"MATHEMATICS","Score":null,"Total":0}
引用次数: 2

Abstract

Abstrak. Metode dinamika molekuler digunakan untuk mempelajari deposisi atom tembaga (Cu) pada substrat silikon (Si). Interaksi atom-atom Si-Si, Cu-Cu, dan Cu-Si masing-masing dideskripsikan dengan potensial interatomik Tersoff, MEAM, dan Morse. Ensembel NVE dan termostat Berendsen digunakan dalam simulasi ini. Kemudian diinvestigasi pengaruh parameter kecepatan awal dan laju deposisi terhadap persentase struktur amorf, fungsi distribusi radial (RDF), dan bilangan koordinasi. Hasil simulasi menunjukkan perbedaan yang signifikan terhadap persentase struktur amorf pada parameter yang bervariasi. Investigasi pasca-simulasi menunjukkan variasi pada nilai RDF dan bilangan koordinasi. Kata kunci: Metode dinamika molekuler, evolusi struktur, fungsi distribusi radial, bilangan koordinasi Study of Structure Evolution of Copper Deposition on Silicon Substrate using Molecular Dynamics Method Abstract.  The Molecular dynamics method was used to study the deposition of copper (Cu) atoms onto silicon (Si) substrate. The interaction of Si-Si Cu-Cu, and Cu-Si atoms were described by Tersoff, MEAM, and Morse interatomic potentials respectively. NVE ensemble and Berendsen thermostat was used in this simulation. The effect of initial velocity and deposition rate on the percentage of amorphous structure, radial distribution function (RDF), and coordination number was investigated. The result showed significant differences of amorphous structure percentage at varied parameters. Post-simulation investigation showed variation in RDF and coordination number. Keywords: Molecular dynamics method, structure evolution, radial distribution function, coordination number
用分子动力学方法研究硅衬底上铜沉积的结构发展
Abstrak。分子量通常用于将铜原子沉积在硅基体上。Si、Cu、Cu和Si原子间的掩蔽与Tersoff、MEAM和Morse原子间的潜在掩蔽有关。NVE的安装和Berendsen的温度在模拟中使用。研究人员发现,参数的变化速度和沉积速度取决于结构、径向分布函数(RDF)和边界条件。模拟结果表明,在参数变化的情况下,显著降低了结构成本。对模拟环境的研究表明,RDF和基准的变化。Kata kunci:Metode dinamika molekuler,evolusi struktur,fungsi distributusi radial,bilangan koordinasi用分子动力学方法研究硅衬底上铜沉积的结构演化摘要。采用分子动力学方法研究了铜原子在硅衬底上的沉积过程。分别用Tersoff、MEAM和Morse原子间势描述了Si-Si-Cu-Cu和Cu-Si原子的相互作用。NVE系综和Berendsen恒温器被用于该模拟。研究了初始速度和沉积速率对非晶结构百分比、径向分布函数(RDF)和配位数的影响。结果表明,在不同的参数下,非晶结构百分比存在显著差异。模拟后的调查显示RDF和配位数的变化。关键词:分子动力学方法,结构演化,径向分布函数,配位数
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来源期刊
Matematika
Matematika MATHEMATICS-
自引率
25.00%
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审稿时长
24 weeks
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