Miriam Ugarte Querejeta, Miren Illarramendi Rezabal, Gorka Unamuno, Jose Luis Bellanco, Eneko Ugalde, Antonio Valor Valor
{"title":"Implementation of a holistic digital twin solution for design prototyping and virtual commissioning","authors":"Miriam Ugarte Querejeta, Miren Illarramendi Rezabal, Gorka Unamuno, Jose Luis Bellanco, Eneko Ugalde, Antonio Valor Valor","doi":"10.1049/cim2.12058","DOIUrl":null,"url":null,"abstract":"<p>Industry 4.0 has ushered in a new era of digital manufacturing and in this context, digital twins are considered as the next wave of simulation technologies. The development and commissioning of Cyber Physical Systems (CPS) is taking advantage of these technologies to improve product quality while reducing costs and time to market. However, existing practices of virtual design prototyping and commissioning require the cooperation of domain specific engineering fields. This involves considerable effort as development is mostly carried out in different departments using vendor specific simulation tools. There is still no integrated simulation environment commercially available, in which all engineering disciplines can work collaboratively. This presents a major challenge when interlinking virtual models with their physical counterparts. This paper therefore addresses these challenges by implementing a holistic and vendor agnostic digital twin solution for design prototyping and commissioning practices. The solution was tested in an industrial use case, in which the digital twin effectively prototyped cost-efficient solar assembly lines.</p>","PeriodicalId":33286,"journal":{"name":"IET Collaborative Intelligent Manufacturing","volume":"4 4","pages":"326-335"},"PeriodicalIF":2.5000,"publicationDate":"2022-07-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ietresearch.onlinelibrary.wiley.com/doi/epdf/10.1049/cim2.12058","citationCount":"5","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IET Collaborative Intelligent Manufacturing","FirstCategoryId":"1085","ListUrlMain":"https://onlinelibrary.wiley.com/doi/10.1049/cim2.12058","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, INDUSTRIAL","Score":null,"Total":0}
引用次数: 5
Abstract
Industry 4.0 has ushered in a new era of digital manufacturing and in this context, digital twins are considered as the next wave of simulation technologies. The development and commissioning of Cyber Physical Systems (CPS) is taking advantage of these technologies to improve product quality while reducing costs and time to market. However, existing practices of virtual design prototyping and commissioning require the cooperation of domain specific engineering fields. This involves considerable effort as development is mostly carried out in different departments using vendor specific simulation tools. There is still no integrated simulation environment commercially available, in which all engineering disciplines can work collaboratively. This presents a major challenge when interlinking virtual models with their physical counterparts. This paper therefore addresses these challenges by implementing a holistic and vendor agnostic digital twin solution for design prototyping and commissioning practices. The solution was tested in an industrial use case, in which the digital twin effectively prototyped cost-efficient solar assembly lines.
期刊介绍:
IET Collaborative Intelligent Manufacturing is a Gold Open Access journal that focuses on the development of efficient and adaptive production and distribution systems. It aims to meet the ever-changing market demands by publishing original research on methodologies and techniques for the application of intelligence, data science, and emerging information and communication technologies in various aspects of manufacturing, such as design, modeling, simulation, planning, and optimization of products, processes, production, and assembly.
The journal is indexed in COMPENDEX (Elsevier), Directory of Open Access Journals (DOAJ), Emerging Sources Citation Index (Clarivate Analytics), INSPEC (IET), SCOPUS (Elsevier) and Web of Science (Clarivate Analytics).