Fatigue and Fracture Behavior of AlSi10Mg Manufactured by Selective Laser Melting: A Review

IF 1.8 4区 材料科学 Q2 MATERIALS SCIENCE, CHARACTERIZATION & TESTING
Z. Jiang, J. Sun, F. Berto, X. Wang, G. Qian
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引用次数: 1

Abstract

Selective laser melting (SLM) is one of the most promising metal additive manufacturing technologies. SLMed Al-Si alloys have been widely used in the rail transport, aerospace, and automotive industries. Recently, the fatigue and fracture properties of SLMed Al-Si alloys have attracted considerable attention due to their application in critical load-bearing structures. This review aims to better understand the recent progress on the fatigue and fracture investigations of SLMed Al-Si alloys, especially AlSi10Mg, with emphasis on the effect of defects, heterogeneous microstructure, residual stress, and post-treatment methods. In addition, fatigue and fracture modeling methods are discussed. Finally, the challenges and future research opportunities are prospected.

Abstract Image

选择性激光熔化制备AlSi10Mg合金的疲劳与断裂行为研究进展
选择性激光熔化(SLM)是目前最有前途的金属增材制造技术之一。SLMed铝硅合金已广泛应用于铁路运输、航空航天和汽车工业。近年来,由于SLMed Al-Si合金在关键承重结构中的应用,其疲劳和断裂性能受到了广泛的关注。本文旨在更好地了解SLMed Al-Si合金,特别是AlSi10Mg合金的疲劳和断裂研究的最新进展,重点介绍了缺陷、异质组织、残余应力和后处理方法的影响。此外,还讨论了疲劳和断裂建模方法。最后,展望了未来的研究机遇和面临的挑战。
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来源期刊
Physical Mesomechanics
Physical Mesomechanics Materials Science-General Materials Science
CiteScore
3.50
自引率
18.80%
发文量
48
期刊介绍: The journal provides an international medium for the publication of theoretical and experimental studies and reviews related in the physical mesomechanics and also solid-state physics, mechanics, materials science, geodynamics, non-destructive testing and in a large number of other fields where the physical mesomechanics may be used extensively. Papers dealing with the processing, characterization, structure and physical properties and computational aspects of the mesomechanics of heterogeneous media, fracture mesomechanics, physical mesomechanics of materials, mesomechanics applications for geodynamics and tectonics, mesomechanics of smart materials and materials for electronics, non-destructive testing are viewed as suitable for publication.
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