{"title":"Hot-Melt Adhesives: Fundamentals, Formulations, and Applications: A Critical Review","authors":"Swaroop Gharde, G. Sharma, B. Kandasubramanian","doi":"10.7569/raa.2020.097301","DOIUrl":null,"url":null,"abstract":"Hot-Melt Adhesives (HMAs) are typically used in applications where instant sealing is critically required. HMAs are generally preferred for those applications where processing speed is critical. These materials are widely used in various engineering applications, mainly as sealants\n in leakages and crack filling of walls and roofs. The industrial use of HMAs is most common in glassware and automobiles for gluing glasses in buildings and bonding heavy motor parts. The formulation of HMAs contains a polymer of suitable nature that makes the base for a strong adhesive, and\n waxes are added to increase the settling time of adhesive. The tackifiers are used to dilute the polymer to adjust the Glass Transition Temperature (Tg) and to reduce the viscosity for proper flow of hot-melt. This review intends to comprehensively discuss the preparation and formulations\n of HMAs using various polymer matrices, along with their applications and mechanics. The designing of green HMAs has been discussed in the literature and have been promoted over conventional solvent-based HMAs due to their functionality without Volatile Organic Compounds (VOCs). Various measures,\n challenges, and resolutions for making hazard-free HMAs have been discussed in the present review.","PeriodicalId":43792,"journal":{"name":"Reviews of Adhesion and Adhesives","volume":"1 1","pages":""},"PeriodicalIF":3.5000,"publicationDate":"2020-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Reviews of Adhesion and Adhesives","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.7569/raa.2020.097301","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"Materials Science","Score":null,"Total":0}
引用次数: 6
Abstract
Hot-Melt Adhesives (HMAs) are typically used in applications where instant sealing is critically required. HMAs are generally preferred for those applications where processing speed is critical. These materials are widely used in various engineering applications, mainly as sealants
in leakages and crack filling of walls and roofs. The industrial use of HMAs is most common in glassware and automobiles for gluing glasses in buildings and bonding heavy motor parts. The formulation of HMAs contains a polymer of suitable nature that makes the base for a strong adhesive, and
waxes are added to increase the settling time of adhesive. The tackifiers are used to dilute the polymer to adjust the Glass Transition Temperature (Tg) and to reduce the viscosity for proper flow of hot-melt. This review intends to comprehensively discuss the preparation and formulations
of HMAs using various polymer matrices, along with their applications and mechanics. The designing of green HMAs has been discussed in the literature and have been promoted over conventional solvent-based HMAs due to their functionality without Volatile Organic Compounds (VOCs). Various measures,
challenges, and resolutions for making hazard-free HMAs have been discussed in the present review.
期刊介绍:
With the explosion of research activity and reports, the need for concise and critical reviews of topics of contemporary research interest is manifest. Reviews of Adhesion and Adhesives (RAA) provides in-depth, incisive, illuminating and thought-provoking reviews written by subject matter experts covering all aspects of adhesion science and adhesive technology. Each review will be imbued with the author’s experience so that the reader will be able to assimilate the research in the area discussed easily and will be able to apply it in practice.The journal has relevance to a myriad of industries including textiles, printing, coatings, aerospace, medical, nanotechnology, biotechnology, building and construction, and microelectronics. The topics to be covered include, but not limited to, basic and theoretical aspects of adhesion; modeling of adhesion phenomena; mecha¬nisms of adhesion; surface and interfacial analysis and characterization; unraveling of events at interfaces; characterization of interphases; adhesion of thin films and coatings; adhesion aspects in reinforced composites; formation, characterization and durability of adhesive joints; surface preparation methods; polymer surface modification; biological adhesion; particle adhesion; adhesion of metallized plastics; adhesion of diamond-like films; adhesion pro¬moters; contact angle, wettability· and adhesion; superhydrophobicity and superhydrophilicity. With regard to adhesives, RAA will include, but not limited to, green adhesives; novel and high-performance adhesives; and medical adhesive applications.