Research on MEMS dual-channel microwave power sensor with fixed beam structure

IF 2.4 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Chen Li, Ximing Guo, Aodi Xu, Debo Wang
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引用次数: 0

Abstract

To improve the sensitivity and dynamic range of microwave power sensors, a micro-electromechanical system (MEMS) dual-channel microwave power sensor is proposed in this study. The sensor is designed and manufactured using the GaAs monolithic microwave integrated circuit` (MMIC) process and MEMS technology. The microwave performance, overload power and sensitivity are theoretically studied. At 8–12 GHz, the return loss of the sensors with three different fixed beam sizes are approximately −10 dB, which is good microwave performance. The sensitivities for capacitive detection channel of the two sensors with larger sizes are 2.4 fF W−1 @10 GHz and 14.5 fF W−1 @10 GHz, respectively, and the sensitivities of the thermoelectric detection channel of the three sensors is 25.7 mV W−1, 24.9 mV W−1 and 24.2 mV W−1, respectively. Compared with traditional microwave power sensors, the sensor proposed takes into account the advantages of microwave power sensors in both thermoelectric and capacitive structures. This work helps lay the foundation for the design of microwave power sensors with a fixed beam structure and thermoelectric microwave power sensors.
固定波束结构MEMS双通道微波功率传感器的研究
为了提高微波功率传感器的灵敏度和动态范围,本研究提出了一种微机电系统(MEMS)双通道微波功率传感器。该传感器采用GaAs单片微波集成电路(MMIC)工艺和MEMS技术设计和制造。对微波特性、过载功率和灵敏度进行了理论研究。在8–12 GHz时,具有三种不同固定波束尺寸的传感器的回波损耗约为−10 dB,这是良好的微波性能。两个尺寸较大的传感器的电容检测通道在10 GHz时的灵敏度分别为2.4 fF W−1和14.5 fF W‑1,三个传感器的热电检测通道的灵敏度分别是25.7 mV W−1、24.9 mV W−2和24.2 mV W−3。与传统的微波功率传感器相比,该传感器兼顾了微波功率传感器在热电和电容结构方面的优势。这项工作有助于为固定梁结构的微波功率传感器和热电微波功率传感器的设计奠定基础。
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来源期刊
Journal of Micromechanics and Microengineering
Journal of Micromechanics and Microengineering 工程技术-材料科学:综合
CiteScore
4.50
自引率
4.30%
发文量
136
审稿时长
2.8 months
期刊介绍: Journal of Micromechanics and Microengineering (JMM) primarily covers experimental work, however relevant modelling papers are considered where supported by experimental data. The journal is focussed on all aspects of: -nano- and micro- mechanical systems -nano- and micro- electomechanical systems -nano- and micro- electrical and mechatronic systems -nano- and micro- engineering -nano- and micro- scale science Please note that we do not publish materials papers with no obvious application or link to nano- or micro-engineering. Below are some examples of the topics that are included within the scope of the journal: -MEMS and NEMS: Including sensors, optical MEMS/NEMS, RF MEMS/NEMS, etc. -Fabrication techniques and manufacturing: Including micromachining, etching, lithography, deposition, patterning, self-assembly, 3d printing, inkjet printing. -Packaging and Integration technologies. -Materials, testing, and reliability. -Micro- and nano-fluidics: Including optofluidics, acoustofluidics, droplets, microreactors, organ-on-a-chip. -Lab-on-a-chip and micro- and nano-total analysis systems. -Biomedical systems and devices: Including bio MEMS, biosensors, assays, organ-on-a-chip, drug delivery, cells, biointerfaces. -Energy and power: Including power MEMS/NEMS, energy harvesters, actuators, microbatteries. -Electronics: Including flexible electronics, wearable electronics, interface electronics. -Optical systems. -Robotics.
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