Optical and mechanical properties characterizations of transparent polycrystalline MgAl2O4 spinel

IF 2.2 4区 材料科学 Q2 MATERIALS SCIENCE, CERAMICS
Sawao Honda, Yuki Ogihara, A. Ikesue, Y. Aung, Shinobu Hashomoto, Y. Iwamoto
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引用次数: 0

Abstract

ABSTRACT The microstructure and mechanical properties of polycrystalline spinel ceramics (MgAl2O4) with high translucency were investigated. Several kinds of polycrystalline spinel ceramics were prepared under various sintering conditions, and single-crystal spinel and sapphire were used for comparison. The bending strength of polycrystalline spinel with smaller grain size fabricated without sintering aids exceeded that of single-crystal spinel. The bending strength at 1000°C tended to be lower than that at room temperature. The fracture toughness of polycrystalline spinel prepared without sintering aids measured by SEVNB was higher than that of spinel with sintering aids. By estimation of fracture strength considering different fracture origins, the polycrystalline spinel prepared without sintering aids might be fractured mainly from defects around residual spherical voids. If the size of voids can be minimized in polycrystalline spinel fabricated without sintering aids, both high transmission and good mechanical properties could be achieved.
透明多晶MgAl2O4尖晶石的光学和力学性能表征
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来源期刊
Journal of Asian Ceramic Societies
Journal of Asian Ceramic Societies Materials Science-Ceramics and Composites
CiteScore
5.00
自引率
4.30%
发文量
78
审稿时长
10 weeks
期刊介绍: The Journal of Asian Ceramic Societies is an open access journal publishing papers documenting original research and reviews covering all aspects of science and technology of Ceramics, Glasses, Composites, and related materials. These papers include experimental and theoretical aspects emphasizing basic science, processing, microstructure, characteristics, and functionality of ceramic materials. The journal publishes high quality full papers, letters for rapid publication, and in-depth review articles. All papers are subjected to a fair peer-review process.
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