Why parallelism of workpieces becomes convergent during double-sided lapping?

IF 2.4 3区 工程技术 Q3 ENGINEERING, MANUFACTURING
Bo Pan, R. Kang, Xu Zhu, Zhe Yang, Juntao Zhang, Jiang Guo
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引用次数: 0

Abstract

Double-sided lapping (DSL) is a precision process widely used for machining flat workpieces, such as optical windows, wafers, and brake pads owing to its high efficiency and parallelism. However, the mechanism of parallelism error reduced by the DSL process was rarely investigated. Furthermore, the relationship between parallelism and the flatness was not clearly illustrated. To explain why the parallelism of workpieces becomes convergent by the DSL, a theoretical model has been developed in this paper by calculating the parallelism evolution with the consideration of variation contact situations between workpieces and lapping plates for the first time. Moreover, several workpieces, including a slanted one rendering the model close to the actual process, are taken to calculate the parallelism evolution, and the mechanism of the parallelism error reduced by the DSL process is clarified. The calculation result has indicated that the parallelism error was reduced from 100.0 μm to 25.6 μm based on the parallelism evolution model. The experimental results showed that the parallelism improved from 108.6 μm to 28.2 μm, which agreed with the theoretical results well.
为什么双面研磨时工件的平行度会收敛?
双面研磨(DSL)是一种精密工艺,由于其高效率和平行性,被广泛用于加工平面工件,如光学窗口、晶圆和刹车片。然而,DSL过程减少并行度误差的机制很少被研究。此外,平行度和平面度之间的关系没有明确说明。为了解释DSL使工件平行度收敛的原因,本文首次在考虑工件与研磨板接触情况变化的情况下,通过计算平行度演化,建立了一个理论模型。此外,还选取了几个工件,包括一个使模型接近实际过程的倾斜工件,来计算并行度演化,并阐明了DSL过程降低并行度误差的机制。计算结果表明,基于并行度演化模型,并行度误差从100.0μm减小到25.6μm。实验结果表明,平行度从108.6μm提高到28.2μm,与理论结果吻合较好。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
CiteScore
6.80
自引率
20.00%
发文量
126
审稿时长
12 months
期刊介绍: Areas of interest including, but not limited to: Additive manufacturing; Advanced materials and processing; Assembly; Biomedical manufacturing; Bulk deformation processes (e.g., extrusion, forging, wire drawing, etc.); CAD/CAM/CAE; Computer-integrated manufacturing; Control and automation; Cyber-physical systems in manufacturing; Data science-enhanced manufacturing; Design for manufacturing; Electrical and electrochemical machining; Grinding and abrasive processes; Injection molding and other polymer fabrication processes; Inspection and quality control; Laser processes; Machine tool dynamics; Machining processes; Materials handling; Metrology; Micro- and nano-machining and processing; Modeling and simulation; Nontraditional manufacturing processes; Plant engineering and maintenance; Powder processing; Precision and ultra-precision machining; Process engineering; Process planning; Production systems optimization; Rapid prototyping and solid freeform fabrication; Robotics and flexible tooling; Sensing, monitoring, and diagnostics; Sheet and tube metal forming; Sustainable manufacturing; Tribology in manufacturing; Welding and joining
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