{"title":"Pulse density modulation control-based multi-load handling three leg inverter for cooking applications","authors":"P. Vishnuram, R. Gunabalan","doi":"10.1108/cw-07-2021-0187","DOIUrl":null,"url":null,"abstract":"\nPurpose\nInduction heating applications aided by power electronic control have become very attractive in the recent past. For cooking applications, power electronics circuits are very suitable to feed power to multi loads with an appropriate control technique. The purpose of this paper is to develop a three leg inverter to feed power to three loads simultaneously and independently.\n\n\nDesign/methodology/approach\nPulse density modulation control technique is used to control the output power independently with constant switching frequency.\n\n\nFindings\nMulti-load handling converter with independent power control is achieved with reduced number of switching devices (two switches/per load) with simple control strategy.\n\n\nOriginality/value\nThe proposed system is simulated in MATLAB/Simulink, and the thermal analysis is carried out in COMSOL multi-physics software. The hardware realisation is performed for a 1 kW prototype with 20 kHz switching frequency and 10 kHz pulse density modulation frequency. PIC16F877A microcontroller is used to validate the experimental results for various values of control signals (DPDM). The simulation and experimental results are in good agreement and validates the developed system.\n","PeriodicalId":50693,"journal":{"name":"Circuit World","volume":" ","pages":""},"PeriodicalIF":0.8000,"publicationDate":"2022-01-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Circuit World","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1108/cw-07-2021-0187","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Purpose
Induction heating applications aided by power electronic control have become very attractive in the recent past. For cooking applications, power electronics circuits are very suitable to feed power to multi loads with an appropriate control technique. The purpose of this paper is to develop a three leg inverter to feed power to three loads simultaneously and independently.
Design/methodology/approach
Pulse density modulation control technique is used to control the output power independently with constant switching frequency.
Findings
Multi-load handling converter with independent power control is achieved with reduced number of switching devices (two switches/per load) with simple control strategy.
Originality/value
The proposed system is simulated in MATLAB/Simulink, and the thermal analysis is carried out in COMSOL multi-physics software. The hardware realisation is performed for a 1 kW prototype with 20 kHz switching frequency and 10 kHz pulse density modulation frequency. PIC16F877A microcontroller is used to validate the experimental results for various values of control signals (DPDM). The simulation and experimental results are in good agreement and validates the developed system.
期刊介绍:
Circuit World is a platform for state of the art, technical papers and editorials in the areas of electronics circuit, component, assembly, and product design, manufacture, test, and use, including quality, reliability and safety. The journal comprises the multidisciplinary study of the various theories, methodologies, technologies, processes and applications relating to todays and future electronics. Circuit World provides a comprehensive and authoritative information source for research, application and current awareness purposes.
Circuit World covers a broad range of topics, including:
• Circuit theory, design methodology, analysis and simulation
• Digital, analog, microwave and optoelectronic integrated circuits
• Semiconductors, passives, connectors and sensors
• Electronic packaging of components, assemblies and products
• PCB design technologies and processes (controlled impedance, high-speed PCBs, laminates and lamination, laser processes and drilling, moulded interconnect devices, multilayer boards, optical PCBs, single- and double-sided boards, soldering and solderable finishes)
• Design for X (including manufacturability, quality, reliability, maintainability, sustainment, safety, reuse, disposal)
• Internet of Things (IoT).