BIODEGRADATION OF SOLUTIONS FOR CHEMICAL NICKELATION

IF 0.6 Q4 CHEMISTRY, MULTIDISCIPLINARY

Izvestiya Vysshikh Uchebnykh Zavedenii Khimiya i Khimicheskaya Tekhnologiya Pub Date : 2018-10-22 DOI:10.6060/ivkkt.20186109-10.5792

G. M. Mukhametova, E. G. Vinokurov, E. Babusenko, V. D. Skopintsev

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引用次数: 1

Abstract

In this article, we examined the susceptibility of biodegradation of nickel-containing processing solutions and selected fungicidal products which meet the requirements. Technological solutions are characterized by such a priority parameter as the high deposition rate of the nickel coating were subject to biofouling by mycelial fungi, despite the presence of heavy metal ions in solutions. It is established that the development of mycelial fungi in solutions leads to their decomposition and deterioration of technological characteristics. The purpose of the study was to select the fungicide and its corresponding concentrations, which do not adversely affect the process rate and the quality of the coating. The following tasks were posed: investigation of the stability of various solutions for nickel plating to the action of microorganisms; identification of taxonomic affiliation of microorganisms that populate solutions; selection of fungicide, meeting the requirements for neutrality to the components of the solution, as there is no effect on the rate of the process. Based on the results of the experiment, the influence of microorganisms on the technological characteristics of solutions was determined. After the appearance and development of the colonies of mycelial fungi in time solutions, the pH changed to an alkaline region, the deposition rate of the Ni-P coating dropped. Copper sulfate, sodium tetraborate, lactic acid, chloroform was used as inhibitors. The use of copper sulfate fungicide in concentrations of 0.002-0.005 mol/l led to the inhibition of growth of the fungal colonies, but insignificant. Fungicide sodium tetraborate at a concentration of 0.03 mol/l had a noticeable inhibitory effect on the growth of fungi, and also had a positive effect on the rate of the process, which meets all the requirements for this compound. For citation: Mukhametova G.M., Vinokurov E.G., Babusenko E.S., Skopintsev V.D. Biodegradation of solutions for chemical nickelation. Izv. Vyssh. Uchebn. Zaved. Khim. Khim. Tekhnol. 2018. V. 61. N 9-10. P. 89-97

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化学镍化溶液的生物降解

在本文中，我们检测了含镍加工溶液的生物降解敏感性，并选择了符合要求的杀菌产品。技术解决方案的特征在于这样一个优先参数，即尽管溶液中存在重金属离子，但镍涂层的高沉积速率会受到菌丝真菌的生物污染。研究表明，菌丝真菌在溶液中的发育会导致其分解和工艺特性的恶化。本研究的目的是选择不会对工艺速率和涂层质量产生不利影响的杀菌剂及其相应浓度。提出了以下任务：研究各种镀镍溶液对微生物作用的稳定性；确定溶液中微生物的分类隶属关系；杀菌剂的选择，要满足对溶液中性成分的要求，因为对工艺的速率没有影响。根据实验结果，确定了微生物对溶液工艺特性的影响。菌丝真菌菌落在时间溶液中出现和发育后，pH值变为碱性区域，Ni-P涂层的沉积速率下降。使用硫酸铜、四硼酸钠、乳酸、氯仿作为抑制剂。使用浓度为0.002-0.005摩尔/升的硫酸铜杀菌剂可抑制真菌菌落的生长，但不显著。浓度为0.03mol/l的杀菌剂四硼酸钠对真菌的生长有显著的抑制作用，对该过程的速率也有积极影响，满足了该化合物的所有要求。引用：Mukhametova G.M.、Vinokurov E.G.、Babusenko E.S.、Skopintsev V.D.化学镀镍溶液的生物降解。伊兹夫。维什。Uchebn。扎维德。Khim。Khim。Tekhnol。2018年第61条。N 9-10。第89-97页

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来源期刊

Izvestiya Vysshikh Uchebnykh Zavedenii Khimiya i Khimicheskaya Tekhnologiya CHEMISTRY, MULTIDISCIPLINARY-

CiteScore

1.40

自引率

44.40%

发文量