Bubble Effects on Manufacturing of Silicon Nanowires by Metal-Assisted Chemical Etching

IF 2.4 3区 工程技术 Q3 ENGINEERING, MANUFACTURING
Pee-Yew Lee, C. Weng, H. Huang, Li-Yan Wu, Guo-Hao Lu, Chao-Feng Liu, Cheng-You Chen, Ting-Yu Li, Yung-Sheng Lin
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Abstract

Micro/nano-textured Si wafers manufactured using metal-assisted chemical etching (MACE) have been the focus of several studies, but the mechanism of bubble generation during the MACE process affecting textured surfaces has rarely been reported. This study investigated the bubble effect due to the different placement patterns of the Si wafer (face-up, stirred face-down, and face-down). The results indicated that the placement pattern of the Si wafer notably influences the uniformity of outward appearance. However, no significant differences were noted in the scanning electron microscopy images of Si nanowires (SiNWs) at 0.5 h of etching. At 2 h of etching, the outward appearance uniformity of face-up etching was more homogeneous than that of stirred face-down and face-down patterns, and the SiNWs processed through face-up etching were longer (41 μm) than those subjected to stirred face-down etching (36 μm) and face-down etching (32 μm). Therefore, the placement pattern of Si wafer can affect the uniformity and properties of SiNWs because of bubbles trapped inside cavities or between SiNWs.
金属辅助化学刻蚀制备硅纳米线的气泡效应
使用金属辅助化学蚀刻(MACE)制造的微/纳米织构Si晶片一直是一些研究的焦点,但很少报道MACE过程中气泡产生对织构表面的影响机制。本研究调查了硅晶片不同放置模式(面朝上、搅拌面朝下和面朝下)引起的气泡效应。结果表明,硅片的放置方式对其外观的均匀性有显著影响。然而,在蚀刻0.5小时时,在Si纳米线(SiNWs)的扫描电子显微镜图像中没有观察到显著差异。在蚀刻2小时时,面朝上蚀刻的外观均匀性比搅拌面朝下和面朝下图案更均匀,并且通过面朝上蚀刻处理的SiNW比经过搅拌面朝下蚀刻(36μm)和面朝下蚀刻的SiNW长(41μm)。因此,硅晶片的放置图案会影响SiNWs的均匀性和性能,因为气泡被困在空腔内或SiNWs之间。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
CiteScore
6.80
自引率
20.00%
发文量
126
审稿时长
12 months
期刊介绍: Areas of interest including, but not limited to: Additive manufacturing; Advanced materials and processing; Assembly; Biomedical manufacturing; Bulk deformation processes (e.g., extrusion, forging, wire drawing, etc.); CAD/CAM/CAE; Computer-integrated manufacturing; Control and automation; Cyber-physical systems in manufacturing; Data science-enhanced manufacturing; Design for manufacturing; Electrical and electrochemical machining; Grinding and abrasive processes; Injection molding and other polymer fabrication processes; Inspection and quality control; Laser processes; Machine tool dynamics; Machining processes; Materials handling; Metrology; Micro- and nano-machining and processing; Modeling and simulation; Nontraditional manufacturing processes; Plant engineering and maintenance; Powder processing; Precision and ultra-precision machining; Process engineering; Process planning; Production systems optimization; Rapid prototyping and solid freeform fabrication; Robotics and flexible tooling; Sensing, monitoring, and diagnostics; Sheet and tube metal forming; Sustainable manufacturing; Tribology in manufacturing; Welding and joining
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