Pee-Yew Lee, C. Weng, H. Huang, Li-Yan Wu, Guo-Hao Lu, Chao-Feng Liu, Cheng-You Chen, Ting-Yu Li, Yung-Sheng Lin
{"title":"Bubble Effects on Manufacturing of Silicon Nanowires by Metal-Assisted Chemical Etching","authors":"Pee-Yew Lee, C. Weng, H. Huang, Li-Yan Wu, Guo-Hao Lu, Chao-Feng Liu, Cheng-You Chen, Ting-Yu Li, Yung-Sheng Lin","doi":"10.1115/1.4062392","DOIUrl":null,"url":null,"abstract":"\n Micro/nano-textured Si wafers manufactured using metal-assisted chemical etching (MACE) have been the focus of several studies, but the mechanism of bubble generation during the MACE process affecting textured surfaces has rarely been reported. This study investigated the bubble effect due to the different placement patterns of the Si wafer (face-up, stirred face-down, and face-down). The results indicated that the placement pattern of the Si wafer notably influences the uniformity of outward appearance. However, no significant differences were noted in the scanning electron microscopy images of Si nanowires (SiNWs) at 0.5 h of etching. At 2 h of etching, the outward appearance uniformity of face-up etching was more homogeneous than that of stirred face-down and face-down patterns, and the SiNWs processed through face-up etching were longer (41 μm) than those subjected to stirred face-down etching (36 μm) and face-down etching (32 μm). Therefore, the placement pattern of Si wafer can affect the uniformity and properties of SiNWs because of bubbles trapped inside cavities or between SiNWs.","PeriodicalId":16299,"journal":{"name":"Journal of Manufacturing Science and Engineering-transactions of The Asme","volume":null,"pages":null},"PeriodicalIF":2.4000,"publicationDate":"2023-04-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Manufacturing Science and Engineering-transactions of The Asme","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1115/1.4062392","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, MANUFACTURING","Score":null,"Total":0}
引用次数: 0
Abstract
Micro/nano-textured Si wafers manufactured using metal-assisted chemical etching (MACE) have been the focus of several studies, but the mechanism of bubble generation during the MACE process affecting textured surfaces has rarely been reported. This study investigated the bubble effect due to the different placement patterns of the Si wafer (face-up, stirred face-down, and face-down). The results indicated that the placement pattern of the Si wafer notably influences the uniformity of outward appearance. However, no significant differences were noted in the scanning electron microscopy images of Si nanowires (SiNWs) at 0.5 h of etching. At 2 h of etching, the outward appearance uniformity of face-up etching was more homogeneous than that of stirred face-down and face-down patterns, and the SiNWs processed through face-up etching were longer (41 μm) than those subjected to stirred face-down etching (36 μm) and face-down etching (32 μm). Therefore, the placement pattern of Si wafer can affect the uniformity and properties of SiNWs because of bubbles trapped inside cavities or between SiNWs.
期刊介绍:
Areas of interest including, but not limited to: Additive manufacturing; Advanced materials and processing; Assembly; Biomedical manufacturing; Bulk deformation processes (e.g., extrusion, forging, wire drawing, etc.); CAD/CAM/CAE; Computer-integrated manufacturing; Control and automation; Cyber-physical systems in manufacturing; Data science-enhanced manufacturing; Design for manufacturing; Electrical and electrochemical machining; Grinding and abrasive processes; Injection molding and other polymer fabrication processes; Inspection and quality control; Laser processes; Machine tool dynamics; Machining processes; Materials handling; Metrology; Micro- and nano-machining and processing; Modeling and simulation; Nontraditional manufacturing processes; Plant engineering and maintenance; Powder processing; Precision and ultra-precision machining; Process engineering; Process planning; Production systems optimization; Rapid prototyping and solid freeform fabrication; Robotics and flexible tooling; Sensing, monitoring, and diagnostics; Sheet and tube metal forming; Sustainable manufacturing; Tribology in manufacturing; Welding and joining